Wireless Semiconductor Package Heat Dissipation via Die Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face heat dissipation issues, mechanical failures due to repeated heating and cooling cycles, and challenges in attaching wires, which are costly and inefficient.
Innovation Solution
A wireless semiconductor package configuration where semiconductor dies are connected in series without wires, using a thermally and electrically conductive heat sink and lead frame, allowing for efficient heat dissipation and eliminating the need for wire attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to connect semiconductor dies to the lead frame, then electrical connections can be established, but mechanical failures occur due to repeated heating and cooling cycles and wire attachment is costly and inefficient
Solution Approach 1:
The patent removes wires entirely from the semiconductor package structure. Instead of using wire bonds to connect dies to the lead frame, the invention uses direct die-to-lead frame connections through the molding compound, eliminating the problematic wire attachment step that causes mechanical failures during thermal cycling and reduces manufacturing efficiency.
Solution Approach 2:
The patent merges the electrical connection function and thermal conduction function into a single integrated structure. The lead frame serves both as an electrical conductor and a thermal conductor, eliminating the need for separate wire bonds while simultaneously providing both electrical connectivity and heat dissipation pathways.
2Loss of energy
If heat is dissipated from a concentrated area, then the heat dissipation path is simple, but the heat dissipation efficiency is limited
Solution Approach 1:
The patent transitions from concentrated point-to-point heat dissipation through wires to a distributed areal heat dissipation structure. The lead frame with its extended surfaces and the molding compound create a two-dimensional heat distribution network that spreads thermal energy across a larger area, significantly improving heat dissipation efficiency without adding complex active cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively distributes heat over a wider area, enhancing dissipation efficiency and increasing the durability of the device by eliminating wire connections, resulting in improved thermal management and reduced manufacturing costs.
Implementation Method 1
the wireless attachments also function as thermal conductors and dissipate heat
Data Source
AI summary
Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.