Wireless Semiconductor Testing Eliminates Loadboard Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing testing processes for semiconductor devices, such as integrated circuits and systems on chips, are time-consuming and cumbersome due to the need for physical handling and mounting of devices on loadboards, which can lead to increased costs and potential pin breakage.
Innovation Solution
Implementing wireless connectivity, such as Bluetooth low energy or WiFi, to establish connections between the device under test and the tester, allowing for wireless transmission of test patterns and results, thereby reducing the need for physical handling and minimizing pin usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If devices are removed and mounted on loadboards using automated handlers, then testing speed is improved, but handling time and costs increase, and pin breakage risk increases
Solution Approach 1:
The patent extracts the device from the traditional loadboard mounting process and enables direct wireless testing. The tester establishes wireless communication with the device under test without requiring physical removal or mounting, thereby eliminating handling time while maintaining testing capability
Solution Approach 2:
The patent replaces the mechanical mounting and handling system with a wireless communication system. Instead of using automated handlers to physically mount devices on loadboards, the system uses wireless signals (Bluetooth, WiFi) to transmit test patterns and receive results, eliminating mechanical contact and associated handling time
2Ease of operation
If devices are removed and mounted for testing, then testing access is improved, but process complexity and costs increase
Solution Approach 1:
The patent extracts the device from the complex mounting process entirely. By enabling wireless testing, the device remains in its original position on the circuit board, eliminating the need for removal, handling, and remounting steps, thereby simplifying the overall testing process
Solution Approach 2:
The patent introduces wireless communication as an intermediary between the tester and the device under test. This intermediary enables testing access without requiring physical manipulation or mounting, simplifying the process by eliminating intermediate handling steps
3Reliability
If physical handling and mounting is performed, then device positioning is ensured, but pin breakage risk increases
Solution Approach 1:
The patent replaces mechanical handling operations with wireless communication. Test patterns are transmitted wirelessly to the device under test, and results are received wirelessly, eliminating all mechanical contact that could cause pin breakage while maintaining reliable device positioning through wireless connection establishment
Data Source
AI summary
The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.