Wireless Sensor Transmission for Multi-Layer Circuit Board Heat Presses
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Solution Overview
Problem
Current multi-layer circuit board production in multi-platen heat presses involves laborious and time-consuming manual cabling of temperature sensors, posing a burn risk to operators and limiting the ability for real-time process monitoring and control, with measurement values primarily collected offline during experimental testing.
Innovation Solution
A device with a tool logic module and measurement value transmission module that enables wireless transmission of measurement values from sensors to a production control device, eliminating the need for manual cabling within the thermo-compression chamber and allowing for on-line intervention in the production process, using a hybrid transmission method that includes both wireless and cable-bound data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cabling of temperature sensors is performed in the thermo-compression chamber, then measurement values can be obtained for process monitoring, but operator burn risk increases and the process becomes laborious and time-consuming
Solution Approach 1:
The patent extracts the cabling operation from the thermo-compression chamber environment by providing cable guides that route cables from the tool to the exterior of the chamber. This allows measurement values to be obtained while operators remain outside the hazardous hot environment, eliminating the burn risk associated with manual cabling inside the chamber.
Solution Approach 2:
The patent introduces cable guides as an intermediary mechanism between the temperature sensors in the tool and the data storage box outside the chamber. These guides facilitate safe cable routing through the chamber boundary, enabling measurement value transmission without direct operator intervention in the hot zone.
2Loss of time
If measurement values are collected offline during experimental testing, then process parameters can be determined, but real-time process monitoring and control are limited
Solution Approach 1:
The patent implements preliminary action by establishing the complete measurement value transmission infrastructure (sensors, cable guides, data storage box) before production begins. This enables both offline experimental testing and on-line real-time monitoring without requiring separate setups, allowing process parameters to be determined in advance while maintaining continuous monitoring capability during production.
Solution Approach 2:
The patent implements feedback by continuously transmitting measurement values from temperature sensors through cable guides to the data storage box during the production process. This real-time data flow enables on-line intervention and control, allowing process parameters to be adjusted based on current production conditions rather than relying solely on pre-determined offline parameters.
3Reliability
If the tool is equipped with temperature sensors and signal lines for measurement, then production monitoring is enabled, but the equipping process becomes complex and time-consuming
Solution Approach 1:
The patent implements universality by designing cable guides that serve multiple functions: they protect cables from damage, guide cable routing, facilitate installation, and enable both experimental testing and production monitoring configurations. This multi-functional design simplifies the overall equipping process while maintaining comprehensive monitoring capability.
Solution Approach 2:
The patent applies preliminary action by pre-configuring the cable guide system and signal line routing before the tool is placed in service. This preparatory setup simplifies subsequent sensor installation and ensures proper cable management from the outset, reducing the complexity of the equipping process while enabling robust production monitoring.
Data Source
AI summary
A device for producing multi-layer circuit boards, comprising a multi-part tool having a tool lower part and a tool upper part. In the intended use of the tool, multiple functional layers and at least one insulating layer of a multi-layer circuit board to be produced are arranged between the tool lower part and the tool upper part. At least one measuring transducer, is provided between the tool upper part and the tool lower part and is in contact with at least one functional layer and/or an insulating layer of the multi-layer circuit board to be produced. A tool logic module and a measurement value transmission module with a receiving unit and with a transmission unit are provided. The tool logic module is retained on the tool and designed for receiving measurement values of the measuring transducer and wherein the tool logic module has a transmitter.