Wireless Stent With Integrated Circuitry

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Solution Overview

Problem

Current technologies face challenges in creating implantable medical devices, such as stents, with fully integrally fabricated on-board electronic circuitry, relying instead on coupling electronic circuitry to a stent surface using methods like welding or epoxy adhesives.

Innovation Solution

The development of a wireless physiologically active implantable stent with integrally formed on-board electronic circuitry, fabricated using vacuum deposition techniques to combine a stent structure with microelectronic components and electrodes, enabling wireless communication with external devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If electronic circuitry is coupled to stent surface using welding or epoxy adhesives, then device complexity is reduced, but manufacturing precision and integration reliability deteriorate

Engineering Contradiction:
Improvedevice complexityVSAvoidintegration precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent merges the stent structure with electronic circuitry by fabricating both components simultaneously using vacuum deposition techniques. The electronic circuitry is deposited directly onto the stent surface in an integrated manufacturing process, eliminating the need for separate coupling steps and achieving precise integration without additional alignment procedures.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The vacuum deposition process serves multiple functions: it forms the stent structure, creates electronic circuitry, and establishes electrical connections all in one manufacturing step. This multi-functional approach reduces device complexity while maintaining high integration precision through a unified fabrication methodology.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If electronic circuitry is integrally fabricated using vacuum deposition, then manufacturing precision and integration reliability improve, but device complexity increases

Engineering Contradiction:
Improveintegration precisionVSAvoiddevice complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The vacuum deposition process is self-configuring for this application - the same manufacturing process that forms the stent structure automatically creates the electronic circuitry patterns and electrical connections. The system serves itself by using the structural fabrication process to simultaneously create the functional electronic components, reducing overall device complexity despite the advanced manufacturing technique required.

Inventive Principle:
Principle #25Self-service

3Ease of operation

If stent acts as antenna for wireless transmission, then ease of operation improves, but device complexity increases due to integrated circuitry

Engineering Contradiction:
Improvewireless communication capabilityVSAvoiddevice complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The stent structure serves dual functions: it provides structural support as a vascular implant and acts as an antenna for wireless communication. By making the stent itself multifunctional, the patent eliminates the need for separate antenna components, thereby improving ease of operation while actually reducing overall device complexity compared to having distinct structural and communication elements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the creation of implantable stents that can wirelessly communicate with external devices, sense conditions within the body, and stimulate tissue, overcoming the limitations of existing technologies by integrating electronic circuitry directly into the stent structure.

Implementation Method 1

fabricated using vacuum deposition techniques to combine a stent structure with microelectronic components and electrodes

Methodology Applied
Scientific EffectVacuum deposition: Physical Vapour Deposition

Implementation Method 2

The stent 12 may comprise a plurality of structural members forming a tubular structure having a luminal surface facing the body lumen and an abluminal surface facing the body tissue. The stent 12 may be formed having at least one recess in at least one structural member of the plurality structural members. The microelectronic components 14 and electrodes 26 may be formed in situ within the recesses

Methodology Applied
Scientific EffectElectromagnetic signal transmission: Electromagnetic Induction

Data Source

PatentEP3720547B1Physiologically active implantable biomaterials having engineered functional surfaces
Publication Date: 2025.05.28 VACTRONIX SCIENTIFIC LLC
  • EP3720547B1 patent drawingFigure 1
  • EP3720547B1 patent drawingFigure 2

AI summary

Wireless implantable medical devices are disclosed, in particular stents, for operably coupling to and functionally interfacing with tissue, such as vascular tissue, adjacent to the implantable medical device, having integrally formed electronic circuitry configured to sense and/or stimulate tissue, such as nerves, adjacent to or in proximity to the situs of the implantable medical device and capable of transmitting signals from the stent to a remote receiver to interrogate conditions in the body or receive signals to stimulate tissue.