Wireless Substrate Connection via Electromagnetic Induction
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Solution Overview
Problem
Existing electronic circuit substrates connected in a wired manner face issues such as decreased power supply and communication quality due to aged contact parts, and difficulty in reducing size and thickness, while wireless connections are demanded for smaller electronic equipment.
Innovation Solution
The solution involves using electromagnetic induction to connect first and second electronic circuit substrates via coils, allowing for wireless power supply and information communication, reducing the size and thickness of the connection, and improving reliability and durability against environmental deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired connection is used for power supply and communication between electronic circuit substrates, then stable power supply and communication are achieved, but contact parts deteriorate with age and increase device complexity
Solution Approach 1:
The patent replaces the mechanical wired connection system with an electromagnetic induction system. Instead of using physical contact parts that deteriorate with age, the invention uses coils to transmit power and communication signals wirelessly between the main electronic circuit substrate and the sub electronic circuit substrate, eliminating contact part deterioration while maintaining reliable power supply and communication
Solution Approach 2:
The patent introduces coils as an intermediary medium between the two electronic circuit substrates. The coils enable electromagnetic induction to transfer power and signals without direct physical contact, serving as a mediator that eliminates the need for deteriorating contact parts while maintaining stable power supply and communication
2Reliability
If wired connection is used for electronic circuit substrates, then reliable connection is achieved, but size and thickness of the equipment cannot be reduced
Solution Approach 1:
The patent replaces the mechanical wired connection system with an electromagnetic induction system. Instead of using physical contact parts that require space and add thickness, the invention uses coils to transmit power and communication signals wirelessly between the main electronic circuit substrate and the sub electronic circuit substrate, eliminating contact part deterioration while maintaining reliable power supply and communication
3Device complexity
If wireless connection using electromagnetic induction is used, then device size is reduced and contact part deterioration is eliminated, but power transmission efficiency may be affected
Solution Approach 1:
The patent places the sub electronic circuit substrate in a spatial relationship with the main substrate, positioning it to face the coil on the main substrate. This spatial arrangement optimizes the electromagnetic induction coupling between the coils, ensuring efficient power and signal transmission while maintaining the wireless connection benefits
Solution Approach 2:
The patent replaces the mechanical wired connection system with an electromagnetic induction system. Instead of using physical contact parts that require space and add thickness, the invention uses coils to transmit power and communication signals wirelessly between the main electronic circuit substrate and the sub electronic circuit substrate, eliminating contact part deterioration while maintaining reliable power supply and communication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable wireless power transmission and communication between electronic circuit substrates, reducing the size and thickness of the connection, and enhancing the equipment's reliability and durability, while simplifying handling and reducing manufacturing costs.
Implementation Method 1
power is transmitted from the first coil (3a) to the second coil (3b) by electromagnetic induction
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the means for achieving the above is reduced. There are provided a first electronic circuit substrate 2, a second electronic circuit substrate 4, a first coil 3a connected to the first electronic circuit substrate 2, and a second coil 3b connected to the second electronic circuit substrate 4. Power is transmitted from the first coil 3a to the second coil 3b by electromagnetic induction so that the first electronic circuit substrate 2 and the second electronic circuit substrate 4 are electrically connected.