Wireless Substrate-like Particle Sensor for Semiconductor Tools
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Solution Overview
Problem
Current semiconductor processing tools face challenges in detecting and isolating microscopic particles on wafers due to dirty equipment and poor process conditions, leading to yield degradation and high costs from wafer scrap, as traditional methods are time-consuming and lack spatial accuracy in identifying particle deposition sources.
Innovation Solution
A wireless substrate-like particle sensor with a substrate-like base and electronics enclosure, equipped with a power source, controller, and particle sensor, which provides real-time detection of particles using optical or MEMS mass-based techniques, including an electrostatic electrode to attract particles, and radio frequency communication for immediate feedback to process engineers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional particle counting methods are used before and after test runs, then particle presence can be detected, but the process is time-consuming and lacks spatial accuracy in identifying particle deposition sources
Solution Approach 1:
A particle sensor is installed within the semiconductor processing tool to detect particles in real-time during the processing operation, rather than requiring separate pre- and post-test run counting procedures. This preliminary monitoring approach enables immediate detection of particle deposition events as they occur during the actual processing step.
Solution Approach 2:
The particle sensor provides real-time feedback about particle presence and deposition locations to the control system during processing. This feedback mechanism allows operators to immediately identify where particles are being deposited within the tool, enabling targeted cleaning actions rather than general tool maintenance.
2Loss of information
If traditional particle counting methods are used before and after test runs, then particle presence can be detected, but spatial accuracy in identifying particle deposition sources is insufficient
Solution Approach 1:
The particle sensor system is divided into multiple sensing zones or detection regions within the processing tool chamber. Each sensor or sensor array monitors specific areas where particle deposition is most likely to occur, such as near quartz windows, mirrors, or other optical components. This segmentation provides spatial resolution of particle locations without requiring a completely complex monitoring system.
Solution Approach 2:
The particle sensor acts as an intermediary device that indirectly detects particle deposition by monitoring changes in light transmission, scattering, or other physical parameters in different regions of the tool. This intermediary approach provides location information without requiring direct physical contact with or complex instrumentation of the processing zones.
3Productivity
If real-time particle monitoring is implemented, then maintenance downtime and wafer scrap can be reduced, but device complexity increases
Solution Approach 1:
The particle sensor system is designed to perform multiple functions: detecting particle presence, determining particle location, providing real-time alerts, and potentially triggering automated cleaning sequences. By consolidating these functions into a single integrated system rather than separate devices, the overall device complexity is managed while achieving real-time monitoring capabilities that improve productivity.
Solution Approach 2:
The particle monitoring system is integrated into the existing processing tool control architecture, utilizing the tool's existing power sources, control circuits, and communication interfaces. This self-service approach allows the particle sensor to operate without requiring separate complex support systems, reducing the overall device complexity while enabling real-time monitoring that prevents wafer scrap and reduces maintenance downtime.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time, precise monitoring of particles within semiconductor processing tools, reducing maintenance downtime and wafer scrap by providing immediate indication of particle presence and location, thus enhancing the cleanliness and efficiency of the processing tools.
Implementation Method 1
The sensing of particles can be done in accordance with various techniques. One exemplary technique provided herein includes optically sensing particles proximate a substrate-like wireless sensor.
Implementation Method 2
Another embodiment includes sensing the mass of particles deposited upon a mechanical structure coupled to the wireless substrate-like sensor.
Implementation Method 3
including an electrostatic electrode to attract particles
Data Source
AI summary
A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.