Wireless Test Board for Semiconductor Packages
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Solution Overview
Problem
The increasing complexity of semiconductor package testing due to the demand for smaller, higher-performance electronic devices has led to longer test times, necessitating larger and more cumbersome testing equipment.
Innovation Solution
A test board and system that includes a board substrate, a device under test (DUT) socket, a test controller, a wireless signal unit for communication with a server, and a wireless power unit for independent testing of semiconductor packages, allowing for wireless signal exchange and power supply without the need for wired connections to a server or power supply unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired connections are used for power supply and signal exchange in testing equipment, then reliable power supply and data communication are achieved, but the size and complexity of testing equipment increase
Solution Approach 1:
The patent replaces wired mechanical connections with wireless electromagnetic field-based power and signal transmission. The wireless power unit uses electromagnetic induction to transfer power without physical contact, and the wireless signal unit uses electromagnetic waves for data communication, eliminating the need for complex wired connections while maintaining reliability
Solution Approach 2:
The patent introduces electromagnetic fields as an intermediary medium for power and signal transmission. The wireless power unit and wireless signal unit act as intermediaries that convert electrical signals into electromagnetic fields for wireless transmission, then convert them back at the receiving end, enabling contactless communication and power supply
2Adaptability or versatility
If larger testing equipment is used to handle complex semiconductor package testing, then testing capability is improved, but space use efficiency decreases
Solution Approach 1:
The test board integrates multiple functions into a single compact unit: the wireless power unit provides power supply, the wireless signal unit handles data communication, the DUT socket accommodates semiconductor packages, and the test controller manages testing operations. This multi-functional integration allows comprehensive testing capabilities in a compact form factor
Solution Approach 2:
The patent combines power supply, signal communication, and testing functions into a single integrated test board system. The wireless power unit and wireless signal unit are merged with the test controller and DUT socket on one board, eliminating the need for separate external equipment and reducing overall space requirements
3Productivity
If independent testing is implemented without wired connections, then testing efficiency is improved, but power supply and signal communication reliability may be compromised
Solution Approach 1:
The test board performs testing operations independently using its own integrated wireless power unit and wireless signal unit. The system autonomously receives power wirelessly, communicates test data wirelessly, and executes testing sequences without requiring external wired connections, thereby improving testing efficiency while maintaining reliability through self-sufficient operation
Solution Approach 2:
The wireless signal unit establishes bidirectional communication between the test board and external systems, enabling real-time feedback for test result transmission and control signal reception. This feedback mechanism ensures reliable wireless operation by allowing continuous monitoring and adjustment of transmission parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient, independent testing of semiconductor packages, reducing the size and complexity of testing equipment, improving space use efficiency, and shortening the time required for testing and manufacturing processes.
Implementation Method 1
a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket
Implementation Method 2
a wireless signal unit configured to wirelessly exchange signals with a server
Data Source
AI summary
A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.