Wiring Base Lead Layout for Impedance-Matched High-Frequency Signals

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Solution Overview

Problem

Existing optical modules face challenges in impedance matching at the connection between the flexible substrate and the lead terminal, leading to difficulties in achieving desired high-frequency characteristics.

Innovation Solution

The proposed wiring base configuration includes an insulative base with a signal conductor and a ground conductor, where the second lead terminal overlaps the first lead terminal in plan view, ensuring impedance matching and stable high-frequency characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional optical module configuration is used with a flexible substrate connected to the optical module, then the basic signal transmission function is achieved, but impedance matching at the connection between the flexible substrate and the lead terminal becomes difficult, leading to poor high-frequency characteristics

Engineering Contradiction:
Improvehigh-frequency characteristicsVSAvoidimpedance matching
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a new spatial dimension by making the second lead terminal extend in a direction substantially perpendicular to the first lead terminal. This dimensional change allows the second lead terminal to overlap the first lead terminal in plan view, creating a three-dimensional configuration that simultaneously achieves impedance matching and stable high-frequency characteristics without compromising manufacturing precision

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies local quality by making the second lead terminal extend perpendicular to the first lead terminal only in the region where they overlap in plan view. This localized structural modification at the connection point between the flexible substrate and wiring base optimizes impedance matching precisely where it is most critical, while maintaining overall manufacturing feasibility

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12322700B2Wiring base and electronic device
Publication Date: 2025.06.03 KYOCERA CORP
  • US12322700B2 patent drawing
  • US12322700B2 patent drawing
  • US12322700B2 patent drawing

AI summary

In an embodiment of the present disclosure, a wiring base includes an insulative base, a signal conductor, a first lead terminal, a first ground conductor, and a second lead terminal. The insulative base includes a first face and a second face. The signal conductor is provided on the first face. The first lead terminal is provided on the signal conductor. The first lead terminal extends in a first direction and includes a portion projecting from the insulative base in plan view toward the first face. The first ground conductor is provided on the second face. The second lead terminal is provided on the first ground conductor. At least a part of the second lead terminal overlaps the first lead terminal in the plan view toward the first face.