Wiring Board with Embedded Component via Additive Manufacturing
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Solution Overview
Problem
Conventional wiring boards with built-in electronic components face challenges in achieving high functionality and compactness due to limitations in forming fine-pitch conductive patterns and connection terminals, and in maintaining reliable connections and stress tolerance.
Innovation Solution
A method of manufacturing a wiring board with a built-in electronic component involves forming connection terminals using an additive method on a detachable metal foil, electrically connecting the component, covering it with insulative material, and embedding conductive patterns within the material, with through-hole conductors and lands to enhance structural integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to form conductive patterns and connection terminals, then the wiring board can be manufactured, but the pattern accuracy and fine-pitch capability are insufficient
Solution Approach 1:
A release film is introduced as an intermediary layer between the metal foil and the mold during additive manufacturing. This release film enables precise formation of fine-pitch conductive patterns by facilitating easy detachment after curing, thereby achieving high pattern accuracy without compromising manufacturing ease
Solution Approach 2:
The metal foil is prepared with a release film attached beforehand, and the connection terminals are formed on this prepared substrate before the actual additive manufacturing process. This preliminary preparation ensures that fine-pitch patterns can be formed with high accuracy from the outset
2Reliability
If the metal foil is permanently adhered to the support body, then structural stability is maintained, but damage risk during handling increases
Solution Approach 1:
The release film is designed as a temporary, disposable component that is easily detachable after serving its purpose during manufacturing. This allows the metal foil to be firmly held during processing for reliable connection formation, then easily released for handling without damage risk
Solution Approach 2:
The release film acts as a temporary intermediary that provides structural support during manufacturing, then is easily removed to leave the finished product. This intermediary layer prevents damage during handling while maintaining structural stability during the manufacturing process
3Volume of moving object
If the wiring board is made compact with built-in components, then space is saved, but stress tolerance decreases
Solution Approach 1:
Electronic components are embedded within the wiring board structure during the additive manufacturing process, with insulative material and conductive patterns built around them. This nesting approach achieves compactness while the layered structure provides stress distribution and tolerance
Solution Approach 2:
The wiring board employs composite construction with metal foils, insulative materials, resins, and electronic components integrated together. This composite structure provides both compactness and enhanced stress tolerance through the combined properties of different materials working together
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a highly functional and compact wiring board with improved pattern accuracy, reduced damage risk, enhanced anchoring strength, and increased tolerance to stress, allowing for easier handling and processing in multilayer configurations.
Implementation Method 1
a first metal foil detachably adhered on the support body
Implementation Method 2
forming a connection terminal for mounting an electronic component on the first metal foil of the first laminated base material by an additive method
Implementation Method 3
covering the electronic component with an insulative material after the mounting
Data Source
AI summary
A method of manufacturing a wiring board with a built-in electronic component including providing a first base material having a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, mounting an electronic component to the connection terminal such that the electronic component is electrically connected to the connection terminal and mounted on the first base material, covering the electronic component with an insulative material structure having a hollow portion such that the electronic component is accommodated in the hollow portion of the insulative material structure after the mounting and detaching the support body from the first metal foil such that a substrate having the first base material and the insulative material structure is formed.