Wiring Board Adhesion via Laser Diffusion Layer
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Solution Overview
Problem
Conventional methods for manufacturing wiring boards face challenges in achieving strong adhesion between the underlayer and seed layer, leading to peeling issues during the deposition of metal ions from a solid electrolyte membrane.
Innovation Solution
A method involving the formation of a diffusion layer between the underlayer and seed layer using laser irradiation, followed by the deposition of a metal layer without a resin resist pattern, which improves adhesion and simplifies the manufacturing process by eliminating the need for multiple steps and reducing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a power source is coupled to the seed layer to function as a cathode for metal deposition, then metal layer can be deposited on the seed layer, but it becomes difficult to couple the power source to all wiring portions when the wiring pattern becomes minute
Solution Approach 1:
An underlayer is introduced as an intermediary conductive layer between the insulating substrate and the seed layer. The underlayer serves as a common electrical connection that can be easily coupled to the power source, while the seed layer patterns are formed on top of it. This mediator layer solves the problem of powering minute wiring portions by providing a continuous conductive base that is easier to connect than the fragmented seed layer patterns themselves.
2Ease of manufacture
If an underlayer and seed layer are prepared with low adhesion to enable easy removal, then the seed layer can be selectively removed, but the seed layer may peel off from the underlayer during metal deposition
Solution Approach 1:
The interface between the underlayer and seed layer is treated locally with a primer layer that creates selective adhesion. The primer layer is applied only at the underlayer-seed layer interface, providing localized bonding enhancement exactly where needed. This allows the seed layer to remain firmly attached during metal deposition while still enabling selective removal in non-adhered regions, resolving the contradiction between ease of removal and adhesion reliability.
3Manufacturing precision
If multiple manufacturing steps including resin resist patterns are used, then precise wiring patterns can be formed, but the manufacturing process becomes complex and generates waste
Solution Approach 1:
The resin resist pattern step is extracted and eliminated from the manufacturing process. Instead of using resist patterns to define wiring areas, the invention uses direct metal deposition on the underlayer followed by selective removal of excess metal. This extraction of the resist step simplifies the process, reduces waste generation from resist materials and solvents, while maintaining wiring pattern precision through the controlled deposition and removal process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the adhesion between the underlayer and seed layer, preventing peeling and allowing for the formation of a reliable wiring layer with improved manufacturing efficiency and reduced waste generation.
Implementation Method 1
irradiating a wiring portion of the coating layer with a laser beam so as to form a diffusion layer in which an element forming the underlayer and an element forming the coating layer are mutually diffused
Implementation Method 2
form a diffusion layer in which an element forming the underlayer and an element forming the coating layer are mutually diffused
Implementation Method 3
disposing a solid electrolyte membrane between an anode and the seed layer as a cathode, pressing the solid electrolyte membrane against at least the seed layer, and applying voltage between the anode and the underlayer to reduce metal ions contained in the solid electrolyte membrane
Data Source
AI summary
A method for manufacturing a wiring board in which the adhesion between an underlayer and a seed layer is improved. A diffusion layer in which an element forming the underlayer and an element forming a coating layer are mutually diffused is formed between the underlayer and a wiring portion of the coating layer by irradiating the wiring portion with a laser beam. A seed layer is formed by removing a portion excluding the wiring portion of the coating layer from the underlayer. A metal layer is formed by disposing a solid electrolyte membrane between an anode and the seed layer and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from an insulating substrate.