Wiring Board Adhesion Layer for Thermal Dissipation

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Solution Overview

Problem

Existing wiring boards face challenges in maintaining the structural integrity and thermal conductivity of their surface layers, particularly when electronic elements are mounted on them.

Innovation Solution

A wiring board configuration that includes a substrate with first and second surfaces, where first and second layer particles are positioned on these surfaces, respectively, with a metal layer interposed between them, and adhesion layers enhancing the coupling force between these particles and the metal layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal layer is positioned between layer particles to enhance thermal conductivity, then thermal dissipation property is improved, but adhesion between particles and metal layer becomes insufficient

Engineering Contradiction:

Improvethermal dissipation propertyVSAvoidadhesion between particles and metal layer

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

An adhesion layer is introduced as an intermediary between the layer particles and the metal layer. This adhesion layer specifically enhances the bonding strength between the particles and metal layer while maintaining the thermal conductivity benefits of the metal layer structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite structure combining layer particles, adhesion layer, and metal layer. This composite approach allows each material to contribute its specific properties: the layer particles provide structural foundation, the adhesion layer provides bonding strength, and the metal layer provides thermal conductivity.

Inventive Principle:

Principle #40Composite materials

2Reliability

If adhesion layer is added to improve coupling force between particles and metal layer, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvecoupling force between particles and metal layerVSAvoidlayer structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The adhesion layer is applied locally only where needed - specifically at the interfaces between layer particles and the metal layer. This localized approach improves reliability at critical bonding points without unnecessarily complicating the entire device structure.

Inventive Principle:

Principle #3Local quality

3Temperature

If multiple layers (particles, metal layer, adhesion layers) are positioned between first and second surface, then thermal conductivity is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidpositioning precision of multiple layers

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The adhesion layer is formed in advance to create a reliable bonding interface before the metal layer is positioned. This preliminary action ensures proper alignment and reduces the precision requirements for subsequent layer positioning, as the adhesion layer provides a forgiving interface that accommodates minor positioning variations.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases the coupling force between the surface layer particles, reduces the likelihood of particle dropping, and enhances thermal conductivity across the substrate, thereby improving the thermal dissipation properties of the wiring board.

Implementation Method 1

a first adhesion layer positioned between the first layer particle and the metal layer and in contact with the first layer particle and the metal layer, and a second adhesion layer positioned between the second layer particle and the metal layer and in contact with the second layer particle and the metal layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20250159799A1Wiring board, electronic device, and electronic module

Publication Date: 2025.05.15 KYOCERA CORP

AI summary

A wiring board includes a substrate including a first surface and a second surface positioned on an opposite side from the first surface. The substrate includes a first layer particle positioned on a surface layer on a first surface side, a second layer particle adjacent to the first layer particle on a second surface side, a metal layer positioned at least between the first layer particle and the second layer particle, a first adhesion layer positioned between the first layer particle and the metal layer and in contact with the first layer particle and the metal layer, and a second adhesion layer positioned between the second layer particle and the metal layer and in contact with the second layer particle and the metal layer.