Combined Wiring Board Adhesive Bonding Warping Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wiring boards tend to warp during the reflow process for mounting electronic components due to thermal expansion differences between the boards and the mounting frame, and existing methods for fixing multiple boards individually to a frame are inefficient and prone to positional variations.
Innovation Solution
A combined wiring board setup where multiple wiring boards are connected using an adhesive agent and fixed to a metal frame with an accommodation opening, utilizing a crimping process to secure them, which adjusts for thermal expansion differences and reduces warping by bonding the boards together and to the frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple wiring boards are fixed individually to a metal frame, then each board can be secured separately, but the process becomes inefficient and positional variations occur
Solution Approach 1:
Multiple wiring boards are connected to each other through adhesive agent portions before being fixed to the metal frame as a single unit. This merging approach allows all boards to be bonded simultaneously in one operation, improving efficiency while the interconnected structure maintains positional accuracy across all boards.
2Reliability
If wiring boards are fixed to a metal frame during reflow process, then thermal expansion differences can be managed, but warping still occurs due to thermal stress
Solution Approach 1:
Multiple wiring boards are connected through adhesive agent portions to form an integrated structure that is then fixed to the metal frame. This merged structure distributes thermal stress more evenly across all boards, reducing individual board warping while maintaining reliable connections during the reflow process.
3Reliability
If wiring boards are connected using adhesive agent portions, then warping is suppressed through unified bonding, but the complexity of the bonding process increases
Solution Approach 1:
The adhesive agent portions serve dual functions: connecting multiple wiring boards to each other and providing attachment points to the metal frame. This merging of connection functions reduces the number of separate bonding operations needed, thereby suppressing warping while actually simplifying the overall bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses warping in the wiring boards by leveraging the thermal expansion coefficient difference between the metal frame and the boards, while also improving the efficiency of the bonding process and allowing for flexible adjustment of the number of boards.
Implementation Method 1
a combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions
Data Source
AI summary
A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.