Wiring Board With Asymmetric Base Substrate Thickness
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Solution Overview
Problem
Existing wiring boards face challenges in achieving both rigidity and flexibility, particularly when combining substrates of different sizes, which affects their mechanical integrity and ability to absorb impacts without compromising electrical connections.
Innovation Solution
A wiring board design featuring a base substrate with varying thickness between two substrates, where one substrate extends beyond the edge of the other, creating a multi-layer section for rigidity and a fewer-layer section for flexibility, along with built-up vias and through-holes for enhanced electrical connectivity and impact absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a base substrate is laminated between two substrates of different sizes to create a multi-layer section, then rigidity is improved, but device complexity increases
Solution Approach 1:
The base substrate is divided into two distinct thickness portions: a first portion with greater thickness located in the multi-layer section, and a second portion with lesser thickness in the single-layer section. This segmentation allows each region to provide appropriate mechanical properties - the thicker first portion reinforces the multi-layer section for rigidity, while the thinner second portion reduces complexity and material usage in the single-layer extension area.
Solution Approach 2:
Different thickness regions of the base substrate are strategically positioned to match the local structural requirements. The first thickness portion is localized to where the multi-layer section requires additional reinforcement, while the second thickness portion is positioned in the single-layer section where less support is needed. This local quality optimization achieves rigidity enhancement without uniformly increasing device complexity throughout the entire structure.
2Adaptability or versatility
If substrates of different sizes are combined with one extending beyond the other, then flexibility is improved, but manufacturing precision requirements increase
Solution Approach 1:
The base substrate is pre-formed with the asymmetric thickness configuration before lamination with the substrates. The first and second thickness portions are created in advance during base substrate fabrication, establishing the structural framework that guides subsequent substrate alignment. This preliminary action simplifies the manufacturing process by providing a built-in reference structure that reduces the precision requirements for aligning substrates of different sizes.
Data Source
AI summary
A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.