Wiring Board Cap Connection Pattern Segmentation
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Solution Overview
Problem
Conventional wiring boards for semiconductor elements require an increased number of insulating layers and thickness due to the need for the signal strip-shaped pattern to extend under the cap connection pattern, which is frame-shaped, necessitating additional layers.
Innovation Solution
The wiring board features a cap connection pattern formed by island-shaped patterns spaced apart, allowing the strip-shaped signal pattern to extend between these patterns on the upper surface, reducing the number of insulating layers required and achieving a thinner design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the cap connection pattern is formed as a frame-shaped pattern, then the shielding functionality is improved, but the number of insulating layers increases and the board thickness increases
Solution Approach 1:
The cap connection pattern is segmented from a continuous frame shape into multiple isolated island-shaped patterns. These island patterns are spaced apart and connected through via holes to underlying conductor layers, maintaining the grounding and shielding function while eliminating the need for the signal pattern to route under the cap connection pattern, thereby reducing the number of insulating layers required.
2Reliability
If the strip-shaped signal pattern extends under the cap connection pattern, then the electrical connection is improved, but the number of insulating layers increases
Solution Approach 1:
The signal transmission path is moved from a planar route under the cap connection pattern to a vertical route through via holes. The strip-shaped signal pattern extends to the edge of the cap connection pattern, then connects to underlying conductor layers through via holes, utilizing the vertical dimension to bypass the need for additional insulating layers.
3Reliability
If additional insulating layers are added to accommodate the signal pattern routing, then the electrical insulation is improved, but the manufacturing complexity increases
Solution Approach 1:
The existing insulating layers and via hole structures are utilized for multiple purposes: the via holes serve both as connection pathways for the signal pattern and as means to connect the island-shaped cap connection patterns to underlying ground layers. This multi-functionality eliminates the need for additional insulating layers dedicated solely to signal routing, reducing manufacturing complexity.
Data Source
AI summary
The wiring board of the present invention includes at least one insulating layer and at least one conductor layer being alternately laminated, a semiconductor element connection pad formed on an upper surface of the insulating layer at an uppermost layer of the insulating layers, a cap connection pattern arranged so as to surround a region where the semiconductor element connection pad is formed, and at least one strip-shaped pattern extending from the semiconductor element connection pad to a region outside an end portion on the region side of the cap connection pattern. The cap connection pattern is formed by a plurality of island-shaped patterns spaced apart from one another, and the strip-shaped pattern is formed between the adjacent island-shaped patterns on the upper surface of the insulating layer at the uppermost layer.