Wiring Board Thin Film Capacitor Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wiring boards with embedded thin film capacitors face damage due to thermal stress and pressure during semiconductor chip mounting, as the capacitors are not adequately protected.
Innovation Solution
A wiring board configuration featuring an insulating layer, a thin film capacitor, an interconnect layer, and an encapsulating resin layer with a non-photosensitive thermosetting resin, where the encapsulating resin layer covers the pad of the interconnect layer to reduce exposure and protect the capacitor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thin film capacitor is provided at the top surface closer to the semiconductor chip to improve transmission characteristics, then the transmission characteristics are improved, but the thin film capacitor may be damaged due to thermal stress or pressure during mounting
Solution Approach 1:
The patent applies beforehand cushioning by introducing a cushioning layer between the semiconductor chip and the thin film capacitor. This cushioning layer absorbs and mitigates the thermal stress and pressure generated during chip mounting, preventing damage to the thin film capacitor while allowing the capacitor to remain positioned close to the chip for optimal transmission characteristics.
Solution Approach 2:
The cushioning layer serves as an intermediary element between the semiconductor chip and the thin film capacitor. It mediates the harmful mechanical and thermal effects from the chip mounting process, protecting the capacitor without compromising its functional proximity to the chip.
2Object-affected harmful factors
If the thin film capacitor is embedded inside the wiring board to protect it, then damage is reduced, but the transmission characteristics deteriorate due to increased distance from the chip
Solution Approach 1:
Instead of embedding the capacitor deep inside the wiring board, the patent positions it close to the chip surface and applies beforehand cushioning through the cushioning layer. This approach provides protection against mounting stress while maintaining the capacitor's proximity to the chip for optimal transmission characteristics.
Solution Approach 2:
The cushioning layer acts as an intermediary that enables the capacitor to remain exposed near the chip surface while still being protected from damage. It mediates between the need for proximity (for transmission) and the need for protection (from mounting stress).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage to the thin film capacitor by mitigating thermal stress and pressure during semiconductor chip mounting, while also improving mounting reliability and reducing warp in the wiring board.
Implementation Method 1
the encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof, and the encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad
Data Source
AI summary
A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.