Wiring Board Cavities with Variable Depth for Component Fixation
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Solution Overview
Problem
Wiring boards with built-in electronic components face challenges in achieving a balanced size between cavities and electronic components, leading to potential unevenness and insufficient fixation due to cavities being either too large or too small for the components, affecting the rigidity and stability of the substrate.
Innovation Solution
A multilayer core substrate with alternating insulating and conductive layers, featuring cavities of different lengths that penetrate through a central insulating resin layer, accommodates electronic components with build-up layers having distinct resin compositions on either side, ensuring precise cavity sizing and improved fixation through element holding resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cavities are formed to accommodate electronic components in the core substrate, then electronic components can be built-in, but the cavities may be too large or too small causing unevenness and insufficient fixation
Solution Approach 1:
The patent applies local quality by forming cavities with different lengths in the thickness direction based on the specific thickness requirements of different electronic components. Each cavity is locally optimized to match the thickness of the component it accommodates, rather than using a uniform cavity size throughout the substrate. This allows precise fixation for each component while maintaining overall substrate integrity.
Solution Approach 2:
The patent changes the parameter of cavity length in the thickness direction to accommodate electronic components of different thicknesses. By varying this dimensional parameter, the substrate can precisely fit components with different thickness requirements, improving both fixation reliability and manufacturing precision.
2Manufacturing precision
If multiple cavities with different lengths are formed penetrating through the central insulating resin layer, then precise sizing for different components is achieved, but the substrate structure becomes more complex
Solution Approach 1:
The patent segments the insulating resin layers into different thickness regions, with the central insulating resin layer being penetrated by cavities of varying lengths. This segmentation allows each cavity to be independently sized according to component requirements while maintaining a systematic layered structure that manages complexity through modular design.
Solution Approach 2:
The central insulating resin layer serves multiple functions: it provides structural support, acts as an insulating barrier, and accommodates cavities of different lengths for various electronic components. This multi-functionality reduces overall device complexity by using a single layered structure to handle multiple requirements.
3Strength
If build-up layers with different resin compositions are formed on both surfaces, then rigidity and stability are enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies local quality by using different resin compositions for the build-up layers on the first and second surfaces versus the core substrate layers. This allows optimization of surface properties for rigidity and stability while maintaining ease of manufacture by treating each layer region with appropriate material properties rather than requiring uniform composition throughout.
Data Source
AI summary
A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.