Wiring Board Cavity for Semiconductor Noise Reduction
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Solution Overview
Problem
In laminated wiring boards, noise from semiconductor elements can diffuse due to long wiring lengths between the semiconductor element and the electronic component, leading to insufficient noise reduction.
Innovation Solution
A wiring board design featuring a first wiring structure with thin film layers, a cavity for an electronic component, and a filling resin layer, which reduces the length of wiring between the semiconductor element and the electronic component, thereby minimizing noise diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the electronic component is mounted on the main board at the periphery of the relay board, then the noise reduction function is provided, but the wiring length between the semiconductor element and the electronic component becomes long, leading to increased inductance and insufficient noise reduction
Solution Approach 1:
The patent merges the relay board and main board into a single integrated wiring board structure. The relay board's first wiring structure and the main board's second wiring structure are combined, allowing the electronic component to be mounted directly on the integrated board at an optimal position near the semiconductor element, thereby significantly shortening the wiring length while maintaining noise reduction functionality.
Solution Approach 2:
The patent utilizes a multi-layer thin film structure with wiring layers and insulating layers arranged in different dimensions. By routing wirings through multiple layers and using via holes to connect different levels, the wiring path is optimized in three-dimensional space, reducing the effective wiring length between the semiconductor element and electronic component while maintaining electrical connectivity.
2Length of stationary object
If the wiring length is reduced to minimize inductance, then noise diffusion is reduced, but the device structure becomes more complex with thin film layers and cavities
Solution Approach 1:
The patent embeds the electronic component within a cavity formed in the thin film layers of the wiring board. The cavity is created by removing portions of the insulating layers, and the electronic component is positioned inside this nested cavity structure. This nesting approach allows the electronic component to be integrated into the wiring board's internal structure, reducing wiring length while the multi-layer thin film structure provides the necessary electrical connections.
Solution Approach 2:
The patent employs multiple thin film layers consisting of wiring layers and insulating layers to create a flexible, multi-dimensional wiring structure. These thin films allow for compact routing and short wiring paths by utilizing the layering effect, where wirings can be routed through different layers and connected via vias, achieving short effective lengths without requiring complex external wiring arrangements.
Data Source
AI summary
A wiring board includes a first wiring structure and a second wiring structure. The first wiring structure includes: a mounting surface for a semiconductor element; and a back surface on an opposite side of the mounting surface. The second wiring structure is formed on the back surface of the first wiring structure. The first wiring structure further includes thin film layers, a cavity, an electronic component, and a filling resin layer. The thin film layers include laminated wiring layers and laminated insulating layers. The cavity is formed by cutting out at least one of the insulating layers of the thin film layers in a direction toward the mounting surface. The electronic component is located in the cavity. The filling resin layer fills the cavity, and further covers the electronic component.