Wiring Board Conductive Pattern on Electrode Edges
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring boards with built-in electronic components face challenges in ensuring reliable electrical connections and manufacturing efficiency due to the risk of damage to electrodes during the patterning process of conductive layers, particularly when conductive patterns are not formed directly on the outer edges of electrodes.
Innovation Solution
A wiring board design featuring a conductive layer with a planar conductive pattern directly on the outer edges of the electronic component's electrodes, connected via via conductors, and a manufacturing method that includes forming holes in an adhesive layer and using copper plating to create via conductors, which reduces the risk of electrode damage during etching and enhances electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive patterns are formed by conventional patterning processes, then conductive layers can be created on the substrate, but electrodes may be damaged during the etching process
Solution Approach 1:
The patent applies preliminary action by forming the planar conductive pattern directly on the outer edges of the electrode before the etching process. This pre-formed pattern serves as a protective mask during subsequent etching operations, preventing damage to the electrode while enabling conductive layer formation.
Solution Approach 2:
The planar conductive pattern acts as an intermediary element between the electrode and the etching process. By positioning the conductive pattern directly on the electrode's outer edges, it mediates the interaction between the patterning process and the electrode, protecting the electrode from direct exposure to harmful etchants.
2Reliability
If via holes are formed through the insulation layer to connect conductive layers, then electrical connections are established, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges multiple functions into the planar conductive pattern: it serves as both the conductive interconnection layer and the protective mask during etching. The via holes are formed through the insulation layer to connect this multi-functional planar pattern to the electrode, consolidating several manufacturing steps into a more integrated process.
3Reliability
If the planar conductive pattern is positioned directly on the outer edges of the electrode, then electrode damage is prevented, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by concentrating the planar conductive pattern specifically at the outer edges of the electrode where damage risk is highest. Rather than covering the entire electrode surface, the conductive pattern is locally positioned only where it provides maximum protective benefit during etching, optimizing both protection and manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable electrical connections and improves the yield of wiring boards by preventing damage to electrodes during the manufacturing process, thereby enhancing the electrical reliability and cost-effectiveness of the wiring board production.
Implementation Method 1
one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component
Implementation Method 2
a manufacturing method that includes forming holes in an adhesive layer and using copper plating to create via conductors
Data Source
AI summary
A wiring board with a built-in electronic component includes a substrate having an accommodation portion, an electronic component having an electrode and accommodated in the accommodation portion of the substrate, a conductive layer having a planar conductive pattern formed over the electrode of the electronic component, and one or more via conductors connecting the planar conductive pattern of the conductive layer and the electrode of the electronic component. The electrode of the electronic component has a portion which faces the planar conductive pattern of the conductive layer and which has a plurality of outer edges facing outward with respect to a surface of the electronic component on which the portion of the electrode is formed, and the planar conductive pattern of the conductive layer has a portion positioned directly over one or more of the outer edges of the electrode of the electronic component.