Wiring Board Metal Frame Crimping for Warping Control
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Solution Overview
Problem
Existing methods for manufacturing combined wiring boards face challenges in accurately aligning and securely fixing multiple wiring boards to a metal frame, leading to issues with thermal expansion and warping during the reflow process, especially due to differences in thermal expansion coefficients between the wiring boards and the metal frame.
Innovation Solution
A combined wiring board design featuring a metal frame with multiple opening portions, side walls with holding portions, and adjacent slit portions that connect to the openings, allowing for precise positioning and crimping of wiring boards to minimize stress and warping, using crimped portions to securely hold the boards in place while accommodating thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple wiring boards are fixed to a metal frame using conventional methods, then the wiring boards can be accommodated and processed collectively, but alignment accuracy and secure fixing are difficult to achieve, leading to warping during reflow
Solution Approach 1:
The side walls of the opening portions are provided with holding portions at specific locations to locally enhance the fixing capability. This allows precise positioning of wiring boards at critical areas without requiring the entire frame structure to be complex, thereby achieving good alignment accuracy while maintaining structural simplicity.
Solution Approach 2:
The metal frame is divided into multiple opening portions, each with its own holding portions and slit portions. This segmentation allows independent positioning and fixing of each wiring board, improving alignment accuracy for each board while the overall frame structure remains simple and easy to manufacture.
2Reliability
If multiple wiring boards are fixed to a metal frame using conventional methods, then the wiring boards can be accommodated and processed collectively, but secure fixing is difficult to achieve, leading to stress propagation during thermal deformation
Solution Approach 1:
Holding portions are provided at specific locations on the side walls of opening portions where fixing is most needed. This local enhancement of fixing capability ensures secure fixing of wiring boards during thermal deformation without requiring the entire frame structure to be complex.
Solution Approach 2:
Slit portions are provided adjacent to the holding portions to beforehand cushion the stress that arises during thermal deformation. The slits act as stress relief features that prevent stress propagation from affecting the fixed wiring boards, thereby maintaining fixing security without increasing structural complexity.
3Reliability
If conventional fixing methods are used, then manufacturing steps can be kept simple, but warping and stress propagation occur during thermal deformation
Solution Approach 1:
The holding portions are formed by plastic deformation of the side walls at specific locations, providing local warping suppression capability. This approach maintains manufacturing simplicity by using a straightforward forming process rather than requiring complex multi-step manufacturing procedures.
Solution Approach 2:
The metal frame is segmented into multiple opening portions with holding portions and slit portions. This segmentation allows the warping suppression function to be distributed across multiple simple features rather than requiring a single complex structure, thereby maintaining ease of manufacture while achieving good warping suppression.
4Reliability
If holding portions are formed by plastic deformation, then secure fixing is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The holding portions are formed by plastic deformation, which replaces the need for separate mechanical fastening systems such as screws or clips. This substitution achieves secure fixing through material deformation itself, simplifying the overall manufacturing process by eliminating additional fastening components and steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses warping and stress propagation during thermal deformation, enhancing alignment accuracy and reducing manufacturing steps and costs by using crimping to secure the wiring boards, thereby improving the reliability and efficiency of the reflow process.
Implementation Method 1
forming multiple holding portions in side walls of the opening portions in the metal frame by plastic deformation such that the holding portions hold the wiring boards in the opening portions in the metal frame
Data Source
AI summary
A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.