Printed Wiring Board Ground Layout for Crosstalk Shielding
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Solution Overview
Problem
Conventional printed wiring boards do not sufficiently suppress crosstalk between wire patterns, leading to electromagnetic interference.
Innovation Solution
A printed wiring board design featuring a first insulating layer, wire patterns, ground patterns, an adhesive layer, and conductor layers with strategically positioned through-holes that are electrically connected to ground patterns, allowing for effective suppression of crosstalk by blocking electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional wiring board structures are used, then the structure is simple, but crosstalk between wire patterns is not sufficiently suppressed
Solution Approach 1:
The ground pattern is segmented into multiple ground patterns arranged in the wire extending direction, with conductor layers filling the spaces between them. This segmentation creates multiple shielding zones that effectively suppress crosstalk between adjacent wire patterns while maintaining a manageable structural complexity.
Solution Approach 2:
Conductor layers are introduced as intermediary elements between the ground patterns and wire patterns. These conductor layers fill the spaces between ground patterns and extend toward the wire patterns, acting as shielding intermediaries that block electromagnetic interference without requiring direct contact with the signal-carrying wire patterns.
2Object-affected harmful factors
If ground patterns are placed close to wire patterns, then crosstalk suppression is improved, but electromagnetic interference increases
Solution Approach 1:
Conductor layers serve as intermediary shielding elements positioned between the ground patterns and wire patterns. These conductor layers extend from the spaces between ground patterns toward the wire patterns, providing electromagnetic shielding without requiring the ground patterns to be in direct proximity to the wire patterns, thus suppressing crosstalk while minimizing electromagnetic interference.
Solution Approach 2:
The conductor layers are strategically positioned in specific local regions - filling the spaces between ground patterns and extending toward wire patterns where electromagnetic interference is most problematic. This localized shielding approach provides effective crosstalk suppression only where needed, reducing overall electromagnetic interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces crosstalk between wire patterns by utilizing the conductor layers within the through-holes to block electromagnetic interference, enhancing signal integrity.
Implementation Method 1
crosstalk between the first wire pattern and the second wire pattern is suppressed by the conductor layer
Data Source
AI summary
A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern and a first ground pattern disposed on the second main surface and extending along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer side and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer.