Wiring Board Current Path Width Uniformity for MOSFET Power Loss Reduction
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Solution Overview
Problem
Existing electronic devices with high-side and low-side semiconductor chips face performance limitations due to suboptimal wiring board configurations, particularly in motor drive systems, where current path widths are not uniformly designed, leading to inefficiencies in power supply and control signal transmission.
Innovation Solution
The electronic device incorporates a wiring board with uniformly designed current paths for high-side and low-side semiconductor chips, ensuring that the low-side drain terminal is electrically connected to a drain electrode, and power supply potential is uniformly distributed across the board, enhancing the connection between semiconductor devices and output terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If non-uniform current path widths are used in the wiring board, then manufacturing is simpler, but power supply efficiency and control signal transmission deteriorate
Solution Approach 1:
The patent applies local quality by making the current path widths uniform in critical areas where power supply and control signals are transmitted. Specifically, the first conductor pattern (power supply) and second conductor pattern (control signals) maintain uniform widths from the semiconductor devices to the output terminals, ensuring consistent electrical characteristics in these vital pathways while allowing other areas of the wiring board to have varied dimensions for manufacturing flexibility.
2Ease of manufacture
If non-uniform current path widths are used in the wiring board, then manufacturing is simpler, but control signal transmission quality deteriorates
Solution Approach 1:
The patent applies local quality by making the current path widths uniform in critical areas where power supply and control signals are transmitted. Specifically, the first conductor pattern (power supply) and second conductor pattern (control signals) maintain uniform widths from the semiconductor devices to the output terminals, ensuring consistent electrical characteristics in these vital pathways while allowing other areas of the wiring board to have varied dimensions for manufacturing flexibility.
3Reliability
If uniform current path widths are designed, then power supply efficiency and control signal transmission improve, but manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by making the current path widths uniform in critical areas where power supply and control signals are transmitted. Specifically, the first conductor pattern (power supply) and second conductor pattern (control signals) maintain uniform widths from the semiconductor devices to the output terminals, ensuring consistent electrical characteristics in these vital pathways while allowing other areas of the wiring board to have varied dimensions for manufacturing flexibility.
Data Source
AI summary
A plurality of semiconductor devices each including a semiconductor chip having a high-side MOSFET and a semiconductor chip having a low-side MOSFET are mounted on a wiring board (PB1). The wiring board (PB1) includes a power supply wiring WV1 to which a power supply potential is supplied and output wirings WD1, WD2, and WD3 electrically connecting a low-side drain terminal of each of the plurality of semiconductor devices to a plurality of output terminals. A minimum value and a maximum value of a current path width in the power supply wiring WV1 are referred to as a first minimum width and a first maximum width, respectively, and a minimum value and a maximum value of a current path width in the output wirings WD1, WD2, and WD3 are referred to as a second minimum width and a second maximum width, respectively. When the first minimum width is smaller than the second minimum width, the first minimum width is larger than half of the second maximum width, and when the second minimum width is smaller than the first minimum width, the second minimum width is larger than half of the first maximum width.