Wiring Board Manufacturing via Dual Support Plate Segmentation

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Solution Overview

Problem

Existing methods for manufacturing electronic component attached wiring boards face inefficiencies in both the formation of wiring boards and the mounting of electronic components, often resulting in low manufacturing efficiency, high risk of component misalignment, and unreliable connections due to warpage or deflection of thin substrates, and require large equipment for accurate mounting.

Innovation Solution

A method involving a first support plate with a larger size for forming aggregate wiring boards, which are then separated and bonded to a second support plate of a smaller size for precise electronic component mounting, allowing for efficient division into individual wiring boards and ensuring high yield and reliability of connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single large support plate is used for both wiring board formation and electronic component mounting, then manufacturing process is simplified, but manufacturing precision deteriorates due to warpage and deflection of thin substrates

Engineering Contradiction:

Improvemanufacturing process complexityVSAvoidcomponent mounting precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The manufacturing process is divided into two separate stages: first forming aggregate wiring boards on a large first support plate, then transferring them to a smaller second support plate for electronic component mounting. This segmentation allows each support plate to be optimized for its specific function, preventing warpage and deflection issues while maintaining process efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The aggregate wiring boards are formed in advance on the first support plate before electronic component mounting. This preliminary action allows the wiring boards to be prepared with proper support, preventing warpage during formation, and then transferred to the second support plate where they receive additional support during the mounting process.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If a large support plate is used for electronic component mounting, then wiring board formation is efficient, but manufacturing equipment size increases

Engineering Contradiction:

Improvewiring board formation efficiencyVSAvoidmounting equipment size

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The support plate system is segmented into two distinct plates: the first support plate optimized for wiring board formation with larger area to accommodate multiple aggregate wiring boards, and the second support plate optimized for electronic component mounting with smaller area matching the actual component size. This eliminates the need for large mounting equipment while maintaining formation efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The aggregate wiring boards act as intermediaries that are formed on the large first support plate, then transferred to the smaller second support plate for mounting. This intermediary approach allows efficient use of the large plate for formation while using the smaller plate for mounting, avoiding the need for large mounting equipment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If thin substrate is used for wiring board, then device size is reduced, but reliability deteriorates due to warpage and deflection

Engineering Contradiction:

Improvedevice sizeVSAvoidconnection reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The thin substrate wiring boards are formed in advance on the first support plate which provides support during the formation process, preventing warpage and deflection. After formation, the aggregate wiring boards are transferred to the second support plate which continues to provide support during electronic component mounting, ensuring connection reliability throughout the process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The aggregate wiring boards serve as intermediaries that maintain structural integrity during transfer between support plates. The first and second support plates act as intermediary support structures that prevent the thin substrate from warping or deflecting during manufacturing processes, ensuring connection reliability while maintaining small device size.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10477699B2Method for manufacturing electronic component attached wiring board

Publication Date: 2019.11.12 IBIDEN CO LTD

AI summary

A method for manufacturing an electronic component attached board includes preparing a first support plate, forming aggregate wiring boards on the first plate such that the aggregate boards each including wiring board side by side are formed in connected state on surface of the first plate, separating the first plate from the aggregate boards, dividing the aggregate boards into individual aggregate boards each including the wiring boards, bonding a second support plate to surface of each individual aggregate board such that each individual aggregate board is bonded to surface of the second plate, mounting electronic components on the wiring boards on the second plate such that each wiring board has an electronic component thereon, dividing the wiring boards into individual wiring boards, and separating the second plate from the individual wiring board. The surface of the first plate has size larger than size of the surface of the second plate.