Mounting Wiring Board With Ferrite Heating Pattern for Uniform Solder Melting
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Solution Overview
Problem
Microwave heating methods face challenges in efficiently melting solder for mounting electronic devices of varying sizes due to size-dependent microwave absorption, leading to uneven heating and technical constraints in mounting processes.
Innovation Solution
A mounting wiring board with a heat generation pattern smaller than the electrode portion, heated by a standing wave microwave, melts solder efficiently through heat conduction, allowing for uniform heating and mounting of electronic devices regardless of size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If microwave irradiation is used to heat solder for mounting electronic devices, then heating time is reduced and internal heating is achieved, but uneven heating occurs for devices of varying sizes due to size-dependent microwave absorption
Solution Approach 1:
A heat generation pattern made of ferrite material is introduced as an intermediary between the microwave field and the solder. The ferrite pattern absorbs microwave energy and converts it to heat, which then conducts to the solder. This mediator enables uniform heating of solder regardless of the electronic device size, resolving the uneven heating problem while maintaining fast heating speeds.
Solution Approach 2:
The heat generation pattern is designed with specific local properties (ferrite material with controlled thickness and area) to selectively generate heat only in the mounting region. This localized heat generation ensures uniform temperature distribution in the solder area while avoiding excessive heating of the entire substrate, addressing the heating uniformity issue.
2Productivity
If conventional microwave heating is applied to micro-sized electronic devices, then heating efficiency decreases due to insufficient microwave absorption by minute members
Solution Approach 1:
The ferrite heat generation pattern serves as a mediator that has high microwave absorption capacity. Instead of relying on the micro-sized electronic devices or solder to absorb microwaves directly, the ferrite pattern absorbs the microwave energy and transfers heat to the solder through thermal conduction, thereby achieving efficient heating of micro-sized components.
Solution Approach 2:
The invention changes the material parameter of the heat generation pattern to ferrite, which has superior microwave absorption properties compared to conventional materials. By controlling the thickness and area parameters of the ferrite pattern, the system achieves optimal heating efficiency for micro-sized devices while preventing excessive heat generation.
3Temperature
If the heat generation pattern area is made large to ensure sufficient heating, then thermal damage to the base increases
Solution Approach 1:
The heat generation pattern is designed with controlled local area and thickness to confine heat generation to only the necessary mounting region. This localized approach ensures sufficient temperature rise for solder melting while limiting the spread of heat to the base, thereby preventing thermal damage to the substrate.
Solution Approach 2:
The heat generation pattern is implemented as a thin ferrite film or layer on the substrate. This thin-film structure generates heat efficiently in the target area while minimizing thermal conduction to the base, reducing thermal damage. The thin film acts as a controlled heat source that can be precisely managed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-efficiency, low-damage mounting of electronic devices using a standing wave microwave, ensuring consistent solder melting and reducing thermal damage to the base, even for micro-sized devices.
Implementation Method 1
the temperature increases in a short time due to a magnetic loss caused by an action of a magnetic field generated by the microwave irradiation
Implementation Method 2
or due to an induced current excited in metal particles by the action of the magnetic field
Implementation Method 3
A heat conduction occurs from the heat generation pattern with the increased temperature to the solder on a base disposed on the support
Implementation Method 4
heating the heat generation pattern in a predetermined shape disposed on a support by microwave irradiation
Implementation Method 5
an action of a magnetic field generated by the microwave irradiation
Data Source
AI summary
A mounting wiring board, containing a base, an electrode portion disposed on the base, and a heat generation pattern disposed on the electrode portion and to be heated by a standing wave of a microwave, in which an occupation area of the heat generation pattern is smaller than an area of an upper surface of the electrode portion;an electronic device mounting board using the mounting wiring board;a method of mounting the electronic device;a microwave heating method, which contains heating an object to be heated provided via the heat generation pattern; anda microwave heating apparatus.