Wiring Board Groove Intersection for Probe Card Electroplating
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Solution Overview
Problem
Existing wiring boards face challenges in ensuring uniform electroplating of electrode pads, particularly those that are not electrically continuous with the wiring conductor, leading to insufficient current supply and incomplete plating.
Innovation Solution
The proposed wiring board design includes a connection conductor with an intersection part that intersects a groove, allowing for the supply of current to target electrode pads through both the wiring conductor and the connection conductor, with the groove being cut using a beam to remove unnecessary electrical continuity after electroplating, thereby achieving a desired wiring pattern with improved reliability and reduced complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a connection conductor is added to supply current to electrode pads not electrically continuous with the wiring conductor, then electroplating uniformity is improved, but device complexity increases
Solution Approach 1:
An intersection part is introduced as an intermediary element that connects the connection conductor to the wiring conductor through the groove. This intersection part acts as a mediator that enables current flow to electrode pads not directly connected to the wiring conductor, thereby achieving uniform electroplating without significantly increasing overall device complexity.
Solution Approach 2:
The connection conductor is divided into multiple segments including a first connection conductor, a second connection conductor, and an intersection part. This segmentation allows the current path to be distributed through different conductors and layers, enabling comprehensive current supply to all electrode pads while maintaining structural organization.
2Manufacturing precision
If a groove is introduced to cut the connection conductor after electroplating, then desired wiring pattern is achieved, but manufacturing process complexity increases
Solution Approach 1:
The groove is formed in advance before the electroplating process to establish the current path through the intersection part. This preliminary action allows the connection conductor to be properly positioned and connected during electroplating, and subsequent cutting of the connection conductor after plating achieves the desired wiring pattern with a single additional simple step.
3Reliability
If multiple wiring layers are used to route the connection conductor, then current supply to all electrode pads is ensured, but device complexity increases
Solution Approach 1:
The connection conductor is routed through the groove from one wiring layer to another wiring layer, utilizing the vertical dimension between layers. This three-dimensional routing approach enables current supply to electrode pads that are not connected in the same layer, ensuring comprehensive current distribution while maintaining a relatively simple conductor structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures sufficient electroplating of all electrode pads, including those not directly connected to the wiring conductor, by providing an alternative current path through the connection conductor, and allows for high-speed processing with reduced complexity and improved reliability in achieving a desired wiring pattern.
Implementation Method 1
the groove being cut using a beam to remove unnecessary electrical continuity after electroplating
Implementation Method 2
electroplating applied to the electrode pad
Data Source
AI summary
A wiring board includes an insulation substrate, a wiring conductor, a connection conductor, first and second wiring layers, and a groove. The insulation substrate includes a first face. The wiring conductor is located in or on and the connection conductor is located in the insulation substrate. A part of the wiring conductor is included at each of the first and second wiring layers. The groove includes an opening at the first face. The wiring conductor includes an electrode pad and a solid conductor. The solid conductor is included at the second wiring layer. The connection conductor includes first and second connection conductors, a second connection conductor, and an intersection part. The intersection part intersects the groove at the first wiring layer and is located between the first and second connection conductors. The first and second connection conductors are electrically continuous to the electrode pad and the solid conductor, respectively.