Wiring Board Insertion Opening with Integrated Heating for Solder Connection
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Solution Overview
Problem
Conventional coupling structures of printed wiring boards face challenges in ensuring strong and reliable connections between hard printed wiring boards and flexible printed wiring boards, often requiring connectors and land for connection, which occupy valuable space and can be prone to connection strength issues.
Innovation Solution
A wiring board configuration that includes a board insertion opening for a flexible board, with a first connection pattern inside and a second connection pattern on the flexible board, both electrically connected, using solder or brazing filler metal, and a heat generating device to melt the filler metal for secure connection, allowing easy attachment and removal while ensuring electrical continuity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If connectors and land for connection are provided to connect hard printed wiring board with flexible printed wiring board, then connection strength is improved, but space on the printed wiring board is wasted
Solution Approach 1:
The invention merges the connection pattern with the board structure itself. The connection pattern is formed directly on the board surface within the insertion opening, eliminating the need for separate connectors and land areas. This integration achieves both strong electrical connection and efficient space utilization.
Solution Approach 2:
The invention extracts the connection function from separate connector components and embeds it directly into the board structure. The connection pattern is integrated into the board's insertion opening, removing the need for additional connector parts and their associated space requirements.
2Area of stationary object
If pattern on printed wiring board and pattern on flexible printed wiring board are merely in contact or connected by contact pin biased by spring, then space is saved, but connection strength is insufficient
Solution Approach 1:
The invention changes the physical state of the connection interface by applying solder or brazing filler metal that melts and solidifies. This phase change creates a strong metallurgical bond between the connection patterns, transforming a weak mechanical contact into a robust permanent connection while maintaining space efficiency.
Solution Approach 2:
The invention replaces the mechanical spring-biased contact pin system with a thermal processing system. Instead of relying on mechanical force and elastic deformation for connection, the system uses heat to melt filler metal and create a permanent bonds, achieving stronger connections without requiring additional mechanical components.
3Strength
If solder or brazing filler metal is applied and heat generating device is used to melt the filler metal, then connection strength is improved, but device complexity increases
Solution Approach 1:
The heat generating device is integrated directly onto the board structure, allowing the board to perform its own soldering operation. The board's own wiring patterns serve as the heating element, eliminating the need for external heating equipment and reducing overall system complexity while achieving strong soldered connections.
Solution Approach 2:
The wiring pattern on the board serves multiple functions: it provides electrical connection and simultaneously acts as a heating element for melting the solder or brazing filler metal. This multi-functionality reduces the need for separate components, simplifying the overall device structure while achieving strong connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and certain connections between the boards without the need for additional connectors, effectively utilizing space and improving connection strength by using solder or brazing filler metal with a heat generating device to melt and solidify the filler metal for reliable electrical contact.
Implementation Method 1
a heat generating device which generates heat by energization and melts the solder or the brazing filler metal to connect the first connection pattern with the second connection pattern
Implementation Method 2
solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection pattern; and a heat generating device which generates heat by energization and melts the solder or the brazing filler metal
Data Source
AI summary
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern and the second wiring pattern are electrically connected, wherein the first board includes: a board insertion opening in which the second board is inserted; and a first connection pattern provided inside the board insertion opening and electrically connected to the first wiring pattern, and the second board includes: an inserting portion to be inserted into the board insertion opening of the first board; and a second connection pattern provided at a position opposed to the first connection pattern and electrically connected to the second wiring pattern in the case where the inserting portion of the second board is inserted into the board insertion opening of the first board, and further comprising: solder or brazing filler metal applied at least to a surface of one of the first connection pattern and second connection pattern; and a heat generating device which generates heat by energization and melts the solder or the brazing filler metal to connect the first connection pattern with the second connection pattern.