Wiring Board with Insulator Gaps for Miniaturization
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Solution Overview
Problem
Conventional wiring boards face challenges in shrinking while maintaining satisfactory conductivity and mechanical strength, making it difficult to miniaturize semiconductor devices effectively.
Innovation Solution
A wiring board design featuring an insulator layer with exposed connection terminals and gaps along their side surfaces, along with a conductor layer connected to these terminals, allows for reduced thickness while maintaining conductivity and mechanical strength through improved bonding with solder layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the wiring board is shrunk to miniaturize semiconductor devices, then the device size is reduced, but the conductivity and mechanical strength deteriorate
Solution Approach 1:
The patent transitions from a conventional planar connection terminal to a three-dimensional structure where the connection terminal protrudes from the insulator layer surface. This vertical dimensionality change allows improved solder bonding without increasing the horizontal footprint of the wiring board, thus enabling miniaturization while maintaining conductivity and mechanical strength.
Solution Approach 2:
The connection terminal is segmented into distinct functional zones: an exposed first surface for solder bonding, a side surface for additional solder attachment, and integration with the insulator layer. This segmentation allows optimized bonding surfaces that enhance mechanical strength and conductivity without requiring larger overall dimensions.
2Ease of manufacture
If conventional wiring board structures are used, then manufacturing is simpler, but device miniaturization is limited
Solution Approach 1:
The connection terminal is formed to protrude from the insulator layer during the manufacturing process itself, rather than requiring post-processing steps. The gap formation along the side surface is integrated into the manufacturing sequence, enabling miniaturized structures to be achieved through preliminary structural design rather than additional manufacturing complexity.
Data Source
AI summary
A wiring board includes an insulator layer, and a connection terminal having a first surface and a side surface intersecting the first surface. The first surface is exposed from the insulator layer, and the insulator layer includes a gap formed along at least a part of the side surface.