Wiring Board Crosstalk Reduction via Integrated Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Reducing the size of wiring patterns on wiring boards to micro sizes leads to crosstalk noise, and existing solutions like microstrip and coplanar structures increase the number of layers and decrease signal wiring density, making them thick and inefficient.
Innovation Solution
A wiring board structure featuring a first insulator layer with a first wiring layer, a thin inorganic layer covering the wiring pattern and its sides, and a shield part that covers the wiring pattern via the inorganic layer, without increasing the number of layers, to mitigate crosstalk noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If microstrip structure or coplanar structure is used to reduce crosstalk noise, then crosstalk noise is reduced, but the number of layers increases making the wiring board thick
Solution Approach 1:
The patent combines the ground pattern and the planar layer into a single integrated structure. The ground pattern is formed on the same layer as the signal wiring, and the planar layer is formed to cover both the signal wiring and ground pattern, eliminating the need for separate layers for ground and signal, thus reducing the total number of layers while maintaining crosstalk noise reduction effectiveness
Solution Approach 2:
The patent transitions from a vertical stacking approach (multiple layers) to a horizontal integration approach (same layer with planar coverage). By forming the ground pattern and signal wiring on the same layer and using the planar layer to cover both, the solution moves the shielding function from the vertical dimension to the horizontal dimension, reducing board thickness while maintaining noise protection
2Object-affected harmful factors
If coplanar structure with shield pattern is used, then crosstalk noise is reduced, but the density of signal wirings decreases
Solution Approach 1:
The patent merges the ground pattern with the signal wiring on the same layer, allowing signal wirings to be densely packed without requiring separate shield patterns between them. The planar layer provides uniform shielding coverage over all signal wirings, enabling high wiring density while maintaining noise reduction effectiveness
Data Source
AI summary
A wiring board includes an insulator layer, a wiring layer including a wiring pattern and formed on one surface of the insulator layer, an inorganic layer covering a region of the one surface of the insulator layer not formed with the wiring layer, and covering an upper surface and side surfaces of the wiring pattern along a concavo-convex of the wiring pattern, and a shield part covering the wiring pattern via the inorganic layer.