Wiring Board Interconnect Layer Adhesion via Roughened Silane Film
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Solution Overview
Problem
Existing methods for improving bonding strength between the interconnect layer and the insulating layer in wiring boards face challenges in forming a uniform coating on irregular surfaces, leading to insufficient bonding due to physical and chemical bond combinations.
Innovation Solution
A method involving surface roughening of the interconnect layer to form concavo-convex portions, followed by applying a bond-enhancing film using a silane coupling agent and partially removing it with an acid solution to ensure uniform thickness and enhanced adhesion, thereby improving the bonding strength between the interconnect and insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a liquid coating including silane compound is applied on the interconnect layer surface, then chemical bonding strength is improved, but the coating becomes non-uniform on rough surfaces
Solution Approach 1:
The interconnect layer surface is roughened in advance before coating application. This preliminary surface preparation creates concavo-convex structures that enable the subsequent coating to conform uniformly to the surface topology, preventing both thinning at peaks and excessive thickness in valleys
Solution Approach 2:
The surface roughness parameters of the interconnect layer are specifically controlled to optimize coating uniformity. By adjusting the roughness degree, the coating can properly penetrate and adhere to the surface features, achieving uniform thickness while maintaining strong bonding
2Strength
If the interconnect layer surface is roughened to improve bonding, then adhesion is enhanced, but coating penetration becomes difficult
Solution Approach 1:
The surface roughness parameters are optimized to balance adhesion enhancement with coating penetration. The roughness is controlled within specific ranges that provide sufficient mechanical interlocking while allowing the coating liquid to adequately fill and penetrate the surface features
Solution Approach 2:
A composite structure is formed combining the interconnect layer with its roughened surface features and the silane-based coating. This composite approach leverages both the mechanical interlocking from surface roughness and the chemical bonding from silane compounds to achieve superior adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases both physical and chemical bonding strengths, ensuring a reliable connection while maintaining electrical characteristics and preventing surface irregularity-related issues, thus enhancing the overall reliability of the wiring board.
Implementation Method 1
obtains a chemical bonding strength by coating a liquid that includes a silane compound on a surface of the interconnect layer
Implementation Method 2
partially removing the bond enhancing film, using an acid solution
Data Source
AI summary
A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.