Wiring Circuit Board Joint Layout for Stable Inspection Support

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Solution Overview

Problem

The existing wiring circuit boards suffer from low handleability during inspection due to unstable posture of the mounting portion caused by the frame's movement, which is not adequately supported by the supporting member with low resilience.

Innovation Solution

A method for producing a wiring circuit board involving a frame, mounting portion, and joints, where the mounting portion is supported by both a first and second joint, with the first joint being longer and more resilient, and the second joint being shorter and more rigid, allowing for stable posture and correction of swing during inspection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a supporting member with low resilience is used to correct swing, then swing correction is achieved, but the mounting portion posture becomes unstable during inspection

Engineering Contradiction:
Improveswing correctionVSAvoidhandleability
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The supporting member is divided into two separate joints: a first joint with low resilience for swing correction and a second joint with high resilience for stable support during inspection. This segmentation allows each joint to perform its specific function optimally without interfering with the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different resilience characteristics are assigned to different parts of the supporting structure. The first joint has low resilience to enable swing correction, while the second joint has high resilience to provide stable support during inspection, creating local quality variations that satisfy different functional requirements.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the first joint is made longer to improve low resilience, then swing correction is enhanced, but the structural rigidity decreases

Engineering Contradiction:
Improvelow resilienceVSAvoidrigidity
Core Design Contradiction:
Stability of the object's compositionVSStrength

Solution Approach 1:

The supporting function is segmented into two joints with different length and rigidity characteristics. The longer first joint provides low resilience for swing correction, while the shorter second joint provides high rigidity for stable support, allowing both requirements to be satisfied simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different local regions of the supporting structure have different mechanical properties. The first joint is designed with higher length-to-rigidity ratio for swing correction, while the second joint is designed with lower length-to-rigidity ratio for stable support, creating local quality variations that meet different functional needs.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method stabilizes the mounting portion's posture, enhancing handleability and ensuring reliable correction of swing, thereby improving the overall stability and ease of handling during the inspection process.

Implementation Method 1

a first joint and a second joint connecting the frame to the mounting portion... the mounting portion is supported by the frame by the first joint and the second joint... it is possible to stabilize a posture of the mounting portion... it is possible to reliably correct the swing of the mounting portion

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS20260040457A1Wiring circuit board and method for producing wiring circuit board
Publication Date: 2026.02.05 NITTO DENKO CORP
  • US20260040457A1 patent drawing
  • US20260040457A1 patent drawing
  • US20260040457A1 patent drawing

AI summary

A method for producing a product board includes a first step, a second step, and a third step in order. In the first step, an intermediate board including a frame, a mounting portion, a first joint, and a second joint is prepared. The mounting portion is surrounded by the frame. The mounting portion is spaced apart from the frame. The first joint and the second joint connect the frame to the mounting portion. Each of the frame, the mounting portion, and the first joint in the intermediate board includes a base insulating layer and a wiring layer. The wiring layer is disposed on one surface of the base insulating layer in a thickness direction. In the second step, the intermediate board is inspected. In the third step, the second joint is removed.