Wiring Board Heat Dissipation via Mechanical Punching
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Solution Overview
Problem
Conventional printed wiring boards (PWBs) using copper foil struggle with heat dissipation for high-power semiconductor elements like light emitting diodes, leading to performance degradation, and generate waste liquids during manufacturing, increasing costs.
Innovation Solution
A method involving conductive members covered by an insulating member with openings, where second conductive members are joined through these openings, forming a wiring board with improved heat dissipation and reduced waste generation by cutting a layered body to create a mounting surface for semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper foil is used for wiring patterns, then electrical conductivity is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a composite structure combining copper foil for electrical conductivity and aluminum foil for heat dissipation. The copper foil layer provides the necessary electrical pathways, while the aluminum foil layer with its high thermal conductivity efficiently conducts heat away from mounted components, thus resolving the contradiction between electrical conductivity and heat dissipation capability.
2Reliability
If wiring patterns are formed by etching copper foil, then electrical connectivity is improved, but manufacturing cost increases due to waste liquid treatment
Solution Approach 1:
The patent extracts the harmful etching process from the manufacturing workflow by replacing it with a mechanical punching method. Instead of using chemical etchants that generate waste liquids requiring treatment, the invention uses a punching device to directly create wiring patterns by removing material mechanically, thereby eliminating the source of harmful waste and associated treatment costs.
Solution Approach 2:
The patent replaces the chemical system (etching process with chemicals) with a mechanical system (punching process). The punching device mechanically creates wiring patterns through physical removal of material rather than chemical dissolution, substituting a clean mechanical process for a polluting chemical process and thereby reducing manufacturing costs related to waste liquid treatment.
3Reliability
If wet plating is used to form wiring patterns, then electrical conductivity is improved, but environmental harm increases due to plating waste liquid
Solution Approach 1:
The patent extracts and eliminates the wet plating process from the manufacturing sequence by adopting mechanical punching for wiring pattern formation. This removal of the plating step directly eliminates the generation of plating waste liquid and its associated environmental harm, while still achieving the necessary electrical conductivity through the copper foil structure.
Solution Approach 2:
The patent converts the potential harm of material removal during punching into a benefit by designing the process to create precise wiring patterns without requiring subsequent chemical treatments. The mechanical removal process, which could be seen as wasteful, is instead optimized to directly produce the desired conductive pathways, eliminating the need for harmful plating processes.
Data Source
AI summary
A method of manufacturing a wiring board according to one embodiment of the present disclosure includes: providing at least one first conductive member that serves as part of a wiring; covering the at least one first conductive member with an insulating member that has at least one opening; disposing at least one second conductive member on the opening of the insulating member, the second conductive member serving as part of the wiring; electrically joining the at least one first conductive member and the at least one second conductive member to each other at the opening; and cutting a region including the at least one first conductive member, the insulating member, and the at least one second conductive member, to form an element mounting surface.