Multi-Layer Wiring Board Noise Filter Integration
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Solution Overview
Problem
Existing electronic devices face challenges in effectively reducing noise interference between semiconductor components mounted on wiring boards, leading to electromagnetic susceptibility and interference, which affects the stability and performance of semiconductor devices in applications such as motor vehicles and control systems.
Innovation Solution
A noise filter is integrated into the wiring board using conductor patterns in multiple layers, where the first conductor pattern and second conductor pattern face each other with an insulating layer in between, allowing for increased capacitance values without expanding the board area, and are connected via via wires to form an RLC filter circuit, adjusting the cutoff frequency to suit specific frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an anti-noise component such as a condenser is mounted on a wiring board to reduce noise, then noise reduction performance is improved, but the board area increases and device complexity increases
Solution Approach 1:
The patent merges the anti-noise component (condenser) with the existing wiring board structure by forming conductor patterns directly on the board in multiple layers. The first conductor pattern and second conductor pattern face each other with an insulating layer between them, creating an integrated capacitor structure that eliminates the need for separate mounted components, thereby reducing board area while maintaining noise reduction functionality.
Solution Approach 2:
The patent transitions from a two-dimensional single-layer wiring board to a three-dimensional multi-layer structure. By stacking conductor patterns across multiple layers (first wiring layer, second wiring layer, third wiring layer) with insulating layers in between, the design utilizes the vertical dimension to create capacitance without expanding the horizontal board area, effectively solving the space constraint.
2Object-affected harmful factors
If conductor patterns are stacked in multiple layers to form a noise filter, then noise reduction performance is improved, but device complexity increases
Solution Approach 1:
The multi-layer conductor pattern structure serves multiple functions simultaneously: it acts as a noise filter (capacitor), provides electrical connectivity through vias, and maintains signal transmission paths. The same stacked structure that provides capacitance for noise filtering also serves as part of the overall wiring architecture, reducing the need for separate dedicated noise filtering components and thereby managing complexity.
Solution Approach 2:
The patent implements a nested structure where conductor patterns and insulating layers are stacked within each other across multiple layers. The first conductor pattern is nested within the wiring board structure, with the second conductor pattern nested in an adjacent layer, separated by an insulating layer. This nested arrangement creates a compact, integrated noise filter that is embedded within the overall board architecture rather than added as a separate external component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise interference across a wide frequency range, enhancing the operational stability and performance of semiconductor devices by minimizing electromagnetic interference and susceptibility, while maintaining a compact board design.
Implementation Method 1
a first conductor pattern formed in a second wiring layer different from the first wiring layer and electrically connected to the first wire via a first via wire; and a second conductor pattern formed in a third wiring layer different from the first wiring layer and the second wiring layer and supplied with a first fixed potential
Data Source
AI summary
A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.