Wiring Board Layout for Electromagnetic Noise Tolerance
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Solution Overview
Problem
Electronic devices with semiconductor chips and wiring boards face challenges in tolerating external electromagnetic noise due to conduction loops formed by power supply terminals, which can lead to unstable circuit operation and damage from fluctuating magnetic flux.
Innovation Solution
The design involves a wiring board configuration where the board wiring line connects power supply terminals via the inside of the mounting region, reducing the surface area of the conduction loop and using lead-wires and terminals as shields to minimize electromagnetic noise impact, thereby improving noise tolerance without additional countermeasure components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If additional noise countermeasure components like capacitors are added, then the tolerance to electromagnetic noise is improved, but the fabrication cost increases
Solution Approach 1:
The patent applies the self-service principle by using the existing board wiring line and ground pattern structures to achieve electromagnetic noise tolerance without requiring additional countermeasure components. The wiring line's routing through the mounting region and the ground pattern's coverage work together to provide inherent noise immunity, eliminating the need for extra capacitors or other protective components and thereby reducing fabrication costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the electronic device's tolerance to external electromagnetic noise, reducing the risk of circuit instability and damage while potentially lowering fabrication costs by eliminating the need for additional noise countermeasures like capacitors.
Implementation Method 1
a conduction loop may be formed by the conduction path formed inside the semiconductor device, and the board wiring line connecting the plural power supply terminals to each other, and this might lower the tolerance to incident external electromagnetic noise. For example, a power supply voltage fluctuates due to electromagnetic inductance in a case in which there is a change in a magnetic flux passing through the inside of the conduction loop.
Implementation Method 2
using lead-wires and terminals as shields to minimize electromagnetic noise impact
Data Source
AI summary
An electronic device including: a semiconductor device including plural terminals input with voltages having a same potential; and a wiring board including a mounting region at which the semiconductor device is mounted, wherein the wiring board includes a board wiring line formed on the wiring board from a connection portion at which one terminal of the plural terminals is connected, via an inside of the mounting region, to a connection portion at which another terminal of the plural terminals is connected.