Built-In Wiring Board Resin Coating for Pad Adhesion Stability
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Solution Overview
Problem
Existing electronic component built-in wiring boards face challenges in maintaining strong adhesion between the resin coating and the electronic component, leading to potential peeling issues, especially when compared to the adhesion between the coating insulating layer and the component.
Innovation Solution
A structure is developed with a substrate having a cavity, an electronic component with pads, a coating insulating layer, via holes, and a resin coating that has stronger adhesion to the electronic component than the coating insulating layer, with via conductors connecting the pads and a resin coating that partially exposes the pads through holes, enhancing the anchor effect and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating insulating layer is formed on the substrate to cover the electronic component, then the insulating and protective function is improved, but the adhesion strength between the coating and the electronic component becomes insufficient
Solution Approach 1:
A resin coating is introduced as an intermediary layer between the coating insulating layer and the electronic component. This resin coating has stronger adhesion to the electronic component than the coating insulating layer, serving as a mediator that prevents peeling while maintaining the insulating function. The resin coating is applied to the electronic component before the coating insulating layer, creating a layered structure where the resin coating bonds to both the component and the insulating layer.
Solution Approach 2:
The structure employs composite materials by combining the resin coating and coating insulating layer in a layered configuration. The resin coating provides strong adhesion to the electronic component, while the coating insulating layer provides insulating properties. This composite structure leverages the complementary strengths of different materials to simultaneously achieve strong adhesion and effective insulation.
2Stability of the object's composition
If a resin coating with strong adhesion is formed between the coating insulating layer and the electronic component, then the peeling resistance is improved, but the manufacturing process complexity increases
Solution Approach 1:
The resin coating formation process is merged with the existing coating insulating layer formation process. Both layers are applied in sequence during the same manufacturing cycle, with the resin coating applied first to the electronic component, followed by the coating insulating layer. This merging of steps integrates the adhesion-enhancing function into the existing manufacturing flow without requiring separate dedicated process equipment or additional complex工序.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stronger adhesion between the resin coating and the electronic component suppresses peeling, stabilizing the connection and providing a rust prevention property, simplifying the manufacturing process by combining functions typically achieved with separate films.
Implementation Method 1
The resin coating has adhesion to the electronic component that is stronger than adhesion of the coating insulating layer to the electronic component
Data Source
AI summary
An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.