Wiring Board Pad Extension for Lower Capacitance and Socket Compatibility

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Solution Overview

Problem

Existing wiring boards face challenges in reducing the area of the pad's top surface to minimize electrostatic capacitance while maintaining compatibility with conventional sockets, as moving the pad's outer edge inside the insulating layer opening is difficult.

Innovation Solution

A wiring board design featuring a pad with a base portion and an extending portion, integrated with a groove in the insulating layer that exposes the pad's side surface, allowing the pad's outer edge to be positioned inside the insulating layer's opening, thereby reducing the pad's upper surface area without altering the opening size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the area of the pad's top surface is reduced to minimize electrostatic capacitance, then electrical signal quality improves, but compatibility with conventional sockets deteriorates

Engineering Contradiction:

Improveelectrostatic capacitanceVSAvoidcompatibility with conventional sockets

Core Design Contradiction:

Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The pad structure transitions from a conventional flat top surface to a three-dimensional configuration with a base portion and an extending portion that protrudes from the side surface. This dimensional change allows the pad to maintain a smaller upper surface area (reducing capacitance) while the extending portion provides additional connection surface that ensures compatibility with conventional sockets.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of moving object

If the outer edge of the pad is moved to the inner side of the insulating layer opening, then pad area is reduced, but manufacturing difficulty increases

Engineering Contradiction:

Improvepad areaVSAvoidmanufacturing difficulty

Core Design Contradiction:

Area of moving objectVSEase of manufacture

Solution Approach 1:

The pad is segmented into two distinct portions: a base portion that provides structural foundation and electrical connection, and an extending portion that protrudes from the side surface. This segmentation allows each portion to be optimized independently - the base portion can be positioned inside the insulating layer opening while the extending portion extends outward to maintain proper connections, simplifying the manufacturing process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The base portion of the pad is nested within the insulating layer opening, while the extending portion protrudes outward. This nested configuration allows the pad to achieve reduced upper surface area (with the base portion inside the opening) while maintaining functional connectivity (with the extending portion outside), and can be manufactured using sequential plating processes.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS12418981B2Wiring board

Publication Date: 2025.09.16 SHINKO ELECTRIC IND CO LTD

AI summary

A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.