Wiring Board Insulating Particle Density for Ion Migration
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Solution Overview
Problem
Fine and high-density wiring boards face insulation reliability issues due to ion movement between conductors, as ions migrate through the resin insulating layer, compromising the insulating properties between closely spaced wiring.
Innovation Solution
A wiring board design featuring a first insulating layer with insulating particles, conductors spaced at a shorter interval, and a second insulating layer covering them, with a higher concentration of insulating particles at the boundary between the layers, preventing ion movement by increasing particle density in narrow gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fine and high-density wiring is formed with narrow pitch, then wiring density and integration are improved, but ion movement between conductors increases causing insulation degradation
Solution Approach 1:
The patent applies local quality by creating regions with different insulating particle concentrations corresponding to different wiring densities. In high-density wiring regions, the insulating particle concentration is increased to prevent ion movement, while lower concentrations are used in lower-density regions. This localized adjustment of material properties resolves the contradiction by maintaining insulation reliability specifically where wiring density creates the problem.
Solution Approach 2:
The patent changes the concentration parameter of insulating particles in the resin composition based on wiring density. By adjusting the insulating particle concentration parameter locally, the patent prevents ion movement in high-density regions while maintaining overall wiring board performance. This parameter change approach allows the system to adapt to varying wiring densities and maintain insulation reliability.
2Reliability
If insulating particle concentration is increased throughout the entire insulating layer, then ion movement is prevented, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of uniformly increasing insulating particle concentration throughout the entire insulating layer, the patent applies local quality by concentrating particles only in regions where wiring density requires enhanced insulation. This selective approach prevents ion movement where needed while avoiding the manufacturing complexity and cost associated with uniform high-concentration formulations.
Solution Approach 2:
The patent applies partial action by using high insulating particle concentration only in specific high-density wiring regions rather than throughout the entire insulating layer. This partial application of the insulating enhancement resolves the contradiction by providing sufficient insulation reliability only where the wiring density creates ion movement problems, thereby reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances insulation reliability by effectively preventing ion movement between conductors, maintaining excellent insulation even in fine and high-density wiring configurations.
Implementation Method 1
ions contained in the resin (the resin forming the insulating layer) existing between the fine wirings may move from the void formed between the molecular chains constituting the resin to the void
Data Source
AI summary
The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.