Wiring Board Rectangular Via Waveguide Leakage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wiring boards with waveguides experience electromagnetic wave leakage due to gaps between cylindrical conductor pillars, leading to crosstalk with other wiring.
Innovation Solution
The wiring board incorporates a layered structure with insulating layers and a waveguide featuring a pair of conductive layers and conductive pillars arranged in two rows. The conductive pillars include connection pads laminated between the conductive layers and via connections with a rectangular cross-section, reducing gaps and electromagnetic wave leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cylindrical conductor pillars are used in the waveguide, then the manufacturing process is simple and ease of manufacture is improved, but gaps between adjacent pillars increase toward the peripheral edge causing electromagnetic wave leakage
Solution Approach 1:
The patent applies asymmetry by changing the via cross-sectional shape from circular to rectangular. The rectangular via has different dimensions in the lamination direction (width W1) versus the width direction (width W2), creating an asymmetric geometry that reduces gaps between adjacent conductive pillars at the peripheral edges while maintaining manufacturing feasibility through standardized via formation processes.
2Manufacturing precision
If circular via cross-section is used, then manufacturing precision is easier to achieve, but the gap between adjacent conductor pillars increases reducing reliability
Solution Approach 1:
The patent applies parameter changes by modifying the via cross-sectional shape parameters from circular to rectangular, with specific width dimensions W1 (in lamination direction) and W2 (in width direction). This parameter change optimizes the gap between adjacent conductive pillars, reducing electromagnetic wave leakage and improving reliability while maintaining controllable manufacturing precision through standard via formation techniques.
3Reliability
If rectangular via cross-section is used, then electromagnetic wave leakage is suppressed improving reliability, but device complexity increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from circular via cross-sections to rectangular via cross-sections. This dimensional change in the cross-sectional geometry allows for optimized spacing between adjacent conductive pillars, effectively suppressing electromagnetic wave leakage through the gaps while the rectangular shape can be integrated into existing multilayer PCB manufacturing processes, limiting the increase in device complexity.
Data Source
AI summary
A wiring board includes a layered structure and a waveguide. The layered structure include multiple insulating layers that are laminated. The waveguide is formed inside the layered structure. The waveguide includes a pair of conductive layers, and multiple conductive pillars. The pair of the conductive layers face each other in a lamination direction of the insulating layers. The multiple conductive pillars are arranged in two rows along a propagation direction of electromagnetic waves between the pair of the conductive layers, and connects the pair of the conductive layers. The respective conductive pillars include multiple connection pads and a via. The connection pads are laminated between the pair of the conductive layers. The via connects the connection pads of adjacent layers, and has a cross-section perpendicular to the lamination direction in a rectangular shape.