Multilayer Wiring Board Reference Pattern Capacitance Testing

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Solution Overview

Problem

Existing methods for testing multilayer wiring boards require known normal electric capacitance between signal lines and grounded layers, which is either obtained from acceptable products or unreliable calculations, making it costly and prone to production quality fluctuations.

Innovation Solution

A multilayer wiring board with reference patterns of predetermined length, allowing for accurate calculation of normal electric capacitance without preparing acceptable products, by measuring and using area ratios of reference patterns to determine the capacitance values.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If normal electric capacitance is obtained from acceptable products, then measurement precision is improved, but manufacturing cost increases and productivity decreases

Engineering Contradiction:
Improveelectric capacitance measurementVSAvoidproduction efficiency
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent applies preliminary action by incorporating reference patterns into the multilayer wiring board structure during the manufacturing process. These reference patterns are formed in advance as part of the board fabrication, enabling later extraction of normal capacitance values without requiring separate acceptable products for calibration. This eliminates the need to set aside acceptable products for measurement purposes, thereby improving productivity while maintaining measurement precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses reference patterns as copies or representations of the actual wiring paths. Instead of measuring the actual wiring paths directly (which would require acceptable products), the reference patterns serve as standardized copies that can be measured to obtain normal capacitance values. These reference patterns are designed with known dimensions and configurations, allowing them to represent the expected electrical characteristics of the wiring paths without requiring physical acceptable products for measurement.

Inventive Principle:
Principle #26Copying

2Ease of manufacture

If normal electric capacitance is calculated using production quality fluctuations, then manufacturing cost decreases, but measurement precision deteriorates

Engineering Contradiction:
Improvetesting processVSAvoidelectric capacitance calculation
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent replaces the mechanical approach of physically measuring acceptable products with an electrical measurement approach using reference patterns. Instead of relying on calculations that are influenced by mechanical variations in production quality, the system uses electrical capacitance measurements of reference patterns with known geometries. This substitution eliminates the impact of production quality fluctuations on the measurement process, improving precision while maintaining ease of manufacture.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the parameters used for capacitance determination from calculated values based on production dimensions to measured electrical values from reference patterns. By using reference patterns with controlled geometries and measuring their actual capacitance values, the system compensates for production quality fluctuations. This parameter change from calculated to measured values ensures that the normal capacitance values reflect actual electrical characteristics rather than being influenced by manufacturing variations.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If reference patterns are added to multilayer wiring board, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improveelectric capacitance measurementVSAvoidwiring board structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the reference patterns with the existing multilayer wiring board structure. The reference patterns are integrated into the same conductor layers and insulating layers as the actual wiring paths, combining multiple functions into a single unified structure. This merging approach allows the reference patterns to be measured alongside the wiring paths without requiring separate test structures or additional components, thereby improving measurement precision while minimizing the increase in device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The reference patterns serve multiple functions: they act as both structural elements of the wiring board and as measurement references for capacitance calibration. This multi-functionality reduces the need for separate dedicated reference structures, thereby limiting the increase in device complexity. The same conductor layers that form the wiring paths also contain the reference patterns, allowing a single structure to fulfill both signaling and measurement purposes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate determination of normal electric capacitance without influencing production quality fluctuations, reducing costs and ensuring reliable testing for multilayer wiring boards.

Implementation Method 1

measuring, with a measuring device 28, an electric capacitance between the test pad 78 and the uppermost wiring pattern 60

Methodology Applied
Scientific EffectElectric capacitance: Capacitance

Data Source

PatentUS7659727B2Multilayer wiring board and method for testing the same
Publication Date: 2010.02.09 NIHON MICRONICS KK
  • US7659727B2 patent drawing
  • US7659727B2 patent drawing
  • US7659727B2 patent drawing

AI summary

A multilayer wiring board has a ceramic substrate, on which a multilayer wiring section is formed. One of the conductor layers has a grounded pattern. Each of the conductor layers has a reference pattern, which is usable as a standard in calculation of an electric capacitance. An electric capacitance is measured between the grounded pattern and the three-dimensional wiring path. On the other hand, a theoretical electrical capacitance is calculated on the basis of a reference value of electric capacitance which has been measured between the reference pattern and the grounded pattern. The measured value for the wiring path is compared to the calculated value to determine whether the three-dimensional wiring path is good or bad. As the multilayer wiring section has the reference patterns, the electric capacitance for the normal wiring path can be obtained by calculation without preparing the normal acceptable product.