Wiring Board Resin Composition Balancing Dielectric and Foil Adhesion
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Solution Overview
Problem
Existing resin compositions for wiring boards in electronic devices fail to provide adequate low dielectric properties, desmear properties, adhesive properties to metal foils, and high glass transition temperatures, which are essential for high-frequency compatibility, mechanical integrity, and environmental reliability.
Innovation Solution
A resin composition comprising polyphenylene ether compounds with hydroxyl and unsaturated double bonds, reactive compounds like maleimide or benzoxazine compounds, and inorganic fillers, optimized to achieve low dielectric properties, desmear properties, and high adhesive properties with metal foils while maintaining a high glass transition temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether is used as a substrate material for high frequency applications, then low dielectric properties (low relative dielectric constant and low dielectric loss tangent) are improved, but adhesive properties to metal foils and desmear properties deteriorate
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (PPE) with polyphenylene oxide random copolymer (PPO-R) and reactive compounds (maleimide or benzoxazine). This composite approach allows the material to exhibit both low dielectric properties from the PPE component and improved adhesive properties through the reactive compounds that form crosslinked networks, resolving the contradiction between electrical performance and metal foil adhesion.
Solution Approach 2:
The patent modifies the chemical structure and composition parameters of the resin by incorporating specific ratios of PPE (1-50 parts), PPO-R (50-99 parts), and reactive compounds (1-30 parts per 100 parts of PPE+PPO-R). By adjusting these compositional parameters, the material achieves optimal balance between low dielectric constant and adhesive strength to metal foils.
2Reliability
If polyphenylene ether is used as a substrate material for high frequency applications, then low dielectric properties are improved, but desmear properties deteriorate
Solution Approach 1:
The reactive compounds (maleimide or benzoxazine) form a crosslinked network structure within the PPE-PPO-R composite resin. This crosslinked structure provides resistance to smear formation during drilling operations while preserving the low dielectric properties of the PPE base material, thus resolving the contradiction between electrical performance and desmear resistance.
Solution Approach 2:
The patent adjusts the crosslinking density by controlling the amount of reactive compound (1-30 parts per 100 parts of PPE+PPO-R) and the curing conditions. This parameter optimization ensures sufficient desmear resistance without compromising the low dielectric constant and loss tangent required for high frequency applications.
3Strength
If adhesive properties to metal foils are improved, then reliability of wiring boards is improved, but low dielectric properties deteriorate
Solution Approach 1:
The patent creates a multi-functional composite resin where PPE provides low dielectric properties, PPO-R provides processability and baseline adhesion, and reactive compounds (maleimide or benzoxazine) provide enhanced crosslinked adhesion to metal foils. This composite system achieves both strong metal foil adhesion and low dielectric constant simultaneously, resolving the contradiction between these two properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition yields cured products with improved low dielectric properties, effective desmear performance, strong adhesion to metal foils, and enhanced thermal stability, suitable for high-frequency applications and diverse environmental conditions.
Implementation Method 1
a resin composition, a prepreg, a film with resin, a metal foil with resin, a metal-clad laminate, and a wiring board The present invention relates to a resin composition, a prepreg, a film with resin, a metal foil with resin, a metal-clad laminate, and a wiring board
Implementation Method 2
The composition yields cured products with improved low dielectric properties, effective desmear performance, strong adhesion to metal foils, and enhanced thermal stability
Data Source
AI summary
A resin composition containingcontains a polyphenylene ether compound (A) having a hydroxyl group in the molecule, a polyphenylene ether compound (B) having an unsaturated double bond in the molecule, a reactive compound (C) including at least one selected from a maleimide compound (C1) or a benzoxazine compound (C2), and an inorganic filler (D), in which the content of the polyphenylene ether compound (A) is 1 part by mass or more and less than 50 parts by mass with respect to 100 parts by mass of the sum of the polyphenylene ether compound (A) and the polyphenylene ether compound (B).