Multi-layer Wiring Board with Embedded Resin Interposer
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Solution Overview
Problem
Conventional multi-layer wiring boards face challenges in thinning while maintaining reliability and cost-effectiveness, particularly due to the use of silicon or printed bases that increase thickness and manufacturing costs, and lack physical stability.
Innovation Solution
A multi-layer wiring board design featuring stacked resin-based wiring bases with conductive paste vias, where a second wiring base with a smaller pitch is integrated into the electronic component's installing portion, forming patterns that enlarge terminal pitch and connect both surfaces, allowing for thinning without compromising board strength or increasing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon base is used as an interposer to achieve fine wiring pitch, then connection reliability is improved, but board thickness increases and manufacturing cost increases
Solution Approach 1:
The patent changes the material parameter from silicon base to resin base with conductive paste vias, and changes the via structure parameter from through-holes to embedded conductive paste patterns. This allows achieving fine wiring pitch and reliable connections while reducing board thickness and manufacturing cost.
Solution Approach 2:
The patent replaces expensive silicon bases with cheaper resin bases and conductive paste vias. The conductive paste via structure uses inexpensive materials and processes (screen printing, reflow soldering) to achieve the same functional purpose as expensive silicon interposers, thereby reducing manufacturing cost while maintaining connection reliability.
2Reliability
If a silicon base is used as an interposer to achieve fine wiring pitch, then connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive silicon bases with cheaper resin bases and conductive paste vias. The conductive paste via structure uses inexpensive materials and processes (screen printing, reflow soldering) to achieve the same functional purpose as expensive silicon interposers, thereby reducing manufacturing cost while maintaining connection reliability.
Solution Approach 2:
The patent replaces the mechanical silicon base structure with a resin base combined with conductive paste patterns. This substitution uses different materials and manufacturing processes (printing and curing instead of silicon fabrication) to achieve the same electrical connection function, significantly reducing manufacturing complexity and cost.
3Ease of manufacture
If a printed wiring base is disposed in an outermost layer to reduce cost, then manufacturing cost is reduced, but physical stability deteriorates
Solution Approach 1:
The patent moves the conductive paste via structure from a surface-level printed circuit to an embedded within-resin structure. By placing the fine-pitch wiring pattern inside the resin base rather than on the surface, the patent achieves both cost reduction (using printed circuits) and improved physical stability (protected within the resin matrix).
Data Source
AI summary
A multi-layer wiring board that has stacked therein a first printed wiring bases on at least one surface of which a wiring pattern is formed and in which a conductive paste via is formed, that includes an electronic component terminal and a board terminal whose terminal pitch differs from that of the electronic component terminal, and that has an electronic component installed thereon via the electronic component terminal, wherein a second wiring base whose wiring pitch is smaller than that of the first wiring base is built in to a lower portion of an installing portion of the electronic component via the first wiring base, and the second wiring base is connected to the electronic component terminal via the conductive paste via of the first wiring base, has formed on both surfaces thereof a pattern that enlarges the terminal pitch from the electronic component terminal to the board terminal, and includes a via that connects the pattern of the both surfaces.