Wiring Circuit Board With Segmented Conductive Layers
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Solution Overview
Problem
Conventional wiring circuit boards face challenges in ensuring easy connection (mountability) to electronic components while reinforcing desired portions effectively.
Innovation Solution
The wiring circuit board design includes a first insulating layer with a conductive pattern featuring a terminal and wiring, where the wiring has distinct portions - one away from the terminal and another between the terminal and the first portion, utilizing both first and second conductive layers, with an intermediate insulating layer between them, to enhance mountability and reduce electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wiring is made thicker to reinforce the desired portion, then the strength is improved, but the ease of operation deteriorates due to increased contact with electronic components
Solution Approach 1:
The wiring is divided into multiple portions (first portion away from terminal, second portion between terminal and first portion) with different cross-sectional areas. The first portion has a larger cross-sectional area for reinforcement, while the second portion has a smaller cross-sectional area to avoid contact with electronic components, thus resolving the contradiction between strength and mountability.
Solution Approach 2:
Different portions of the wiring are given different local properties - the first portion has a larger cross-sectional area specifically where reinforcement is needed, while the second portion near the terminal maintains a smaller cross-sectional area to ensure ease of mounting electronic components. This localized differentiation resolves the contradiction between overall strength and local mountability.
2Reliability
If a single thick conductive layer is used, then the electrical resistance is reduced, but the mountability deteriorates due to contact with electronic components
Solution Approach 1:
The conductive layer is segmented into multiple portions with different cross-sectional areas. The first portion has a larger cross-section for reduced electrical resistance, while the second portion has a smaller cross-section that prevents contact with electronic components during mounting, thus resolving the contradiction between electrical reliability and mountability.
Solution Approach 2:
The wiring structure implements local quality by providing different cross-sectional dimensions at different locations - a larger cross-section where low electrical resistance is critical, and a smaller cross-section where mountability is critical. This spatial variation in properties resolves the contradiction between electrical performance and ease of assembly.
3Reliability
If the wiring cross-sectional area is increased, then the electrical resistance is reduced, but the mountability deteriorates due to contact with electronic components
Solution Approach 1:
The wiring is segmented into portions with different cross-sectional areas. The first portion has a larger cross-sectional area to reduce electrical resistance and improve conduction reliability, while the second portion has a smaller cross-sectional area that prevents interference with electronic component mounting, thus resolving the contradiction between electrical conduction and mountability.
Solution Approach 2:
Different local cross-sectional dimensions are provided in different portions of the wiring. The larger cross-section is localized to where electrical conduction is most critical, while the smaller cross-section is localized to where mountability is most critical, thereby resolving the contradiction between these two requirements through spatial differentiation.
Data Source
AI summary
A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.