Wiring Board Thermal Conduction Control via Shaft Segmentation
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Solution Overview
Problem
Conventional wiring boards with wide heat-releasing plates experience high thermal conduction, leading to overheating of components and reduced reliability due to excessive heat transfer from semiconductor elements.
Innovation Solution
A wiring board design featuring a rod-shaped shaft member with a flange and heat-releasing plate, where a gap is formed between the plate and the board to reduce thermal conduction, using a rivet with a larger flange diameter to secure the plate while maintaining efficient heat release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the contact area between the heat-releasing plate and the wiring board is increased to improve heat dissipation, then the heat-releasing effect is enhanced, but thermal conduction to the wiring board increases causing components to overheat
Solution Approach 1:
The shaft member is divided into distinct functional sections: a contact section with first diameter for thermal conduction to the heat-releasing plate, and a protruding section with second diameter for mechanical engagement with the wiring board. This segmentation allows independent optimization of thermal and mechanical functions, enabling effective heat dissipation while controlling thermal conduction paths.
Solution Approach 2:
Different sections of the shaft member are given different diameters to perform different functions: the contact section has a larger diameter for efficient thermal contact with the heat-releasing plate, while the protruding section has a smaller diameter to minimize thermal conduction to the wiring board while maintaining mechanical engagement. This local differentiation resolves the contradiction between heat dissipation and thermal conduction control.
2Object-affected harmful factors
If the contact area between the heat-releasing plate and the wiring board is reduced to decrease thermal conduction, then component overheating is reduced, but the heat-releasing effect deteriorates
Solution Approach 1:
The shaft member acts as an intermediary element between the heat-releasing plate and the wiring board. It provides a controlled thermal conduction path through its contact section while its protruding section engages with the wiring board to maintain mechanical stability. This intermediary structure enables heat dissipation from the heat-releasing plate without creating excessive thermal conduction to the wiring board and its mounted components.
3Reliability
If a gap is introduced between the heat-releasing plate and the wiring board to reduce thermal conduction, then component reliability is improved, but the structural stability and heat transfer efficiency may be compromised
Solution Approach 1:
The shaft member is segmented into a contact section for thermal engagement and a protruding section for mechanical engagement. This segmentation allows the contact section to maintain stable thermal contact for heat dissipation while the protruding section extends beyond the heat-releasing plate to provide mechanical stability and structural support, thus maintaining both reliability and structural strength.
Solution Approach 2:
The shaft member extends in the vertical dimension beyond the heat-releasing plate, creating a protruding section that engages with the wiring board at a different spatial level. This dimensional extension allows the structure to maintain stability through mechanical engagement while the heat-releasing plate maintains optimal thermal contact, resolving the contradiction between reliability and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses thermal conduction from the heat-releasing plate to the board, ensuring lower temperatures for components and enhancing reliability by allowing efficient heat dissipation through a narrower contact area.
Implementation Method 1
a gap is formed at least in part between the heat-releasing plate and the board... effectively suppresses thermal conduction from the heat-releasing plate to the board
Data Source
AI summary
A wiring board includes a rod-shaped shaft member including at one end a flange that has a larger diameter than any other portion, a heat-releasing plate including a first through-hole in which the shaft member is inserted, and a board including a second through-hole in which the shaft member is inserted. In the wiring board, a gap is formed at least in part between the heat-releasing plate and the board.