Wiring Board Side Electrode Equipotential Assembly
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Solution Overview
Problem
Existing wiring board manufacturing methods face challenges in efficiently positioning and electrically connecting multiple electronic components within a substrate opening, where adjacent electrodes often have different polarities, leading to complex wiring configurations and potential electrical characteristics degradation.
Innovation Solution
A wiring board design where two electronic components with side electrodes of the same electric potential are positioned in a substrate opening, with a conductive layer connecting these electrodes, and an insulation layer covering the components, facilitating simplified assembly and reduced wiring length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple electronic components with side electrodes of different polarities are positioned in one opening section, then the wiring board can accommodate multiple components, but the wiring configuration becomes complex and electrical characteristics degrade
Solution Approach 1:
The patent positions side electrodes of adjacent electronic components to have the same electric potential, eliminating the need for complex polarity management in wiring. This allows components to be arranged with like electrodes facing each other, simplifying the wiring configuration while accommodating multiple components in a single opening section.
2Length of stationary object
If electronic components are positioned with side electrodes facing each other, then wiring length can be reduced, but positional shifting of components may occur
Solution Approach 1:
By configuring components with like electrodes (same electric potential) facing each other, the patent creates a stable electrical reference that prevents positional shifting. This equipotential arrangement ensures that components remain properly positioned while maintaining minimal wiring length between adjacent electrodes.
3Volume of moving object
If electronic components are miniaturized and highly integrated, then the wiring board size is reduced, but electrical connection reliability may deteriorate
Solution Approach 1:
The patent achieves miniaturization by positioning multiple small electronic components with like electrodes facing each other in a compact arrangement. The equipotential configuration maintains reliable electrical connections despite the reduced size and high integration density, as it eliminates complex wiring paths and potential error sources.
Data Source
AI summary
A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.