Wiring Board Solid Pattern for Voltage Drop Reduction
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Solution Overview
Problem
Conventional wiring boards experience increased electrical resistance due to gas vent openings in the solid pattern, leading to significant voltage drops between semiconductor element connection pads and external connection pads, which can hinder the power supply to semiconductor elements with low operating voltage and high current requirements, potentially impairing their operation.
Innovation Solution
The wiring board incorporates a solid pattern with a straight-line shaped current path that avoids intervention by gas vent openings between through conductors, ensuring uninterrupted current flow and minimizing voltage drops by strategically placing gas vent openings to prevent interference with the current path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If gas vent openings are disposed in the solid pattern for grounding or power supply, then swelling and peeling are prevented, but electrical resistance increases and voltage drops occur
Solution Approach 1:
The patent applies local quality by creating different regions within the solid pattern: a first region with gas vent openings for preventing swelling and peeling, and a second region with a straight current path free of gas vent openings for maintaining low electrical resistance. This localized differentiation allows each region to optimize for its specific function.
Solution Approach 2:
The solid pattern is segmented into multiple functional regions: a first region containing gas vent openings and a second region containing a straight current path. This segmentation separates the gas venting function from the current conduction function, allowing both requirements to be satisfied simultaneously without interference.
2Strength
If gas vent openings are disposed in the solid pattern, then adhesion between insulating layers is improved, but electrical resistance increases
Solution Approach 1:
The patent creates localized regions with different properties: the first region has gas vent openings that improve adhesion and prevent swelling, while the second region maintains a continuous solid pattern for optimal electrical conduction. This local quality differentiation resolves the contradiction between adhesion strength and electrical reliability.
Solution Approach 2:
The patent extracts the gas vent openings from the current path region, placing them only in the first region while keeping the second region free of openings. This extraction ensures that the current flow is not interrupted by gas vent openings, maintaining low electrical resistance while still providing gas venting functionality where needed.
3Reliability
If a straight current path is provided without gas vent openings, then voltage drops are minimized, but gas venting capability is reduced
Solution Approach 1:
The patent segments the solid pattern into a first region with gas vent openings and a second region with a straight current path. This segmentation allows the structure to simultaneously provide gas venting capability through the first region and maintain low voltage drops through the second region's uninterrupted current path.
Solution Approach 2:
The patent merges two functional regions into a single solid pattern: the first region provides gas venting to prevent swelling and peeling, while the second region provides a straight current path for minimal voltage drops. The combination of these regions in one continuous solid pattern achieves both objectives simultaneously.
Data Source
AI summary
A wiring board includes an insulating substrate having a plurality of laminated insulating layers and a mounting part in one surface of the insulating substrate, a large number of semiconductor element connection pads, a large number of external connection pads, and a solid pattern extending from a region corresponding to the mounting part to the peripheral portion of the insulating substrate, and including a straight line shaped current path without intervention of gas vent openings.