Wiring Circuit Board Support Layer Layout to Prevent Member Contact
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Solution Overview
Problem
In conventional wiring circuit boards with a metal-based support layer acting as a heat sink, there is a risk of the wiring body contacting its peripheral members due to movement between connecting bodies.
Innovation Solution
The wiring circuit board design includes an insulating layer with conductive patterns and a metal support layer, where the wiring support portions have a thinner thickness than the terminal support portions, and optionally, the second metal support layer is omitted in these portions to further reduce thickness, minimizing contact with peripheral members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the wiring body is provided with a metal support layer to improve heat dissipation, then heat dissipation performance is improved, but the thickness increases causing contact with peripheral members
Solution Approach 1:
The patent applies local quality by making the support layer thickness non-uniform: the first support layer has a first thickness in the terminal support portion and a second thickness (smaller than the first) in the wiring support portion. This allows the terminal area to maintain sufficient thickness for heat dissipation while the wiring area has reduced thickness to avoid contact with peripheral members.
Solution Approach 2:
The support layer is segmented into multiple layers (first support layer and second support layer) with different thicknesses in different regions. The first support layer provides structural foundation while the second support layer provides additional thickness where needed, creating a multi-layer structure with spatially varying thickness to simultaneously satisfy heat dissipation requirements and avoid peripheral member contact.
2Stability of the object's composition
If the support layer thickness is increased to enhance structural stability, then stability is improved, but the wiring support portion contacts peripheral members
Solution Approach 1:
The patent implements local quality by providing different thicknesses of the support layer in different functional regions: the terminal support portion has greater thickness for structural stability and heat dissipation, while the wiring support portion has reduced thickness to prevent contact with peripheral members during wiring body movement.
Solution Approach 2:
The support layer is divided into multiple segments (first support layer and second support layer) with the second layer being selectively present or absent in different regions. This segmentation allows the terminal area to have full thickness for stability while the wiring area has reduced or no second layer to avoid peripheral member contact.
Data Source
AI summary
A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.