Wiring Circuit Board Layout With Independent Support-Layer Terminals

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Solution Overview

Problem

Existing wiring circuit boards lack sufficient freedom in circuit design due to limitations in structural configuration.

Innovation Solution

A wiring circuit board design that includes a first circuit pattern supported by a metal support layer, with a second circuit pattern independent of the first, featuring a metal layer continuous with the metal support layer and protected by a terminal covering layer, and a conductor layer with high conductivity between the insulating layer and metal support layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a second circuit pattern is formed by separating a portion of the metal support layer, then the degree of freedom in circuit design is improved, but the stiffness of the metal support layer decreases

Engineering Contradiction:

Improvedegree of freedom in circuit designVSAvoidstiffness of metal support layer

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent introduces a conductor layer that is separate from the metal support layer, allowing the second circuit pattern to be formed using the conductor layer instead of separating the metal support layer. This segmentation enables independent design of circuit patterns while preserving the structural integrity and stiffness of the metal support layer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductor layer acts as an intermediary between the metal support layer and the circuit patterns. It provides the conductive path for the second circuit pattern without requiring modification of the metal support layer, thus maintaining structural stiffness while enabling design freedom.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If multiple layers and steps are added to protect metal layers, then protection and reliability are improved, but the number of manufacturing steps increases

Engineering Contradiction:

Improveprotection of metal layersVSAvoidnumber of manufacturing steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the protection function with the existing insulating layer structure. The insulating layer serves dual purposes: electrical insulation and protection of the metal support layer and conductor layer. This merging eliminates the need for separate protective layers and reduces manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The insulating layer is designed to perform multiple functions simultaneously: electrical insulation between conductive elements and mechanical protection of the metal support layer and conductor layer. This multi-functionality reduces the overall complexity of the structure and manufacturing process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250386430A1Wiring circuit board

Publication Date: 2025.12.18 NITTO DENKO CORP

AI summary

A wiring circuit board includes a first insulating layer, a first circuit pattern, a metal support layer, and a second circuit pattern independent of the first circuit pattern. The metal support layer is disposed on the opposite side to the first circuit pattern with respect to the first insulating layer in the thickness direction. The metal support layer is insulated from the first circuit pattern by the first insulating layer, and supports the first circuit pattern and the first insulating layer. The second circuit pattern includes a first terminal. The first terminal has a metal layer continuous with the metal support layer.