Wiring Board Thick Connecting Section for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring boards face challenges in reliably connecting to module substrates and efficiently dissipating heat due to the thinness of inner and external electrodes, which affects the durability and performance of electronic devices.
Innovation Solution
A wiring board design featuring an insulating substrate with cutout portions, inner surface electrodes, external electrodes, and connecting sections where the inner and external electrodes are connected, with the connecting sections being thicker than the individual electrodes to enhance reliability and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inner surface electrode and external electrode are made thin to reduce device size, then the device can be miniaturized, but the connection reliability and heat dissipation capability deteriorate
Solution Approach 1:
The patent applies local quality by making the connecting section thicker than the inner surface electrode and external electrode. This localized thickness increase at the connection point provides enhanced connection reliability and heat dissipation capability without increasing the overall device size, as the thicker portion is confined to a specific local region rather than the entire electrode structure.
2Volume of moving object
If the inner surface electrode and external electrode are made thin to reduce device size, then the device can be miniaturized, but the heat dissipation capability deteriorates
Solution Approach 1:
The connecting section is designed with greater thickness than the inner surface electrode and external electrode, creating a localized heat dissipation path. This thicker connecting section provides improved thermal conduction at the critical connection point where heat needs to be dissipated, without requiring the entire electrode structure to be thick, thus maintaining compact device dimensions.
3Reliability
If the connecting section is made thicker to improve connection reliability, then the connection between wiring board and module substrate becomes more reliable, but the device size increases
Solution Approach 1:
The patent implements local quality by concentrating the increased thickness specifically in the connecting section that interfaces with the module substrate. This localized dimensional increase provides enhanced connection reliability only where needed, rather than uniformly increasing the size of all electrodes, thus minimizing the overall device volume while achieving improved connection reliability.
Data Source
AI summary
A wiring board includes an insulating substrate including a cutout portion that opens in a main surface of the insulating substrate and a side surface of the insulating substrate, an inner surface electrode on an inner surface of the cutout portion, an external electrode on the main surface of the insulating substrate, and a connecting section where the inner surface electrode and the external electrode are connected to each other. The connecting section is thicker than the inner surface electrode and the external electrode.