Flexible Wiring Circuit Board Structure for Thickness-Direction Elasticity
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Solution Overview
Problem
Existing wiring circuit boards face challenges in adjusting the elasticity of wiring portions to allow for elastic movement of electronic components in the thickness direction while maintaining structural integrity.
Innovation Solution
A wiring circuit board design featuring a metal support layer with a thickness ratio to its width less than 1, combined with a conductive layer on one surface, allowing for adjustable elasticity in the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wiring portion is made rigid to maintain structural integrity, then strength is improved, but elasticity in the thickness direction deteriorates
Solution Approach 1:
The wiring portion is divided into multiple layers with distinct functions: the metal support layer provides rigidity and structural integrity, while the conductive layer on the one-side surface provides elasticity in the thickness direction. This segmentation allows each layer to optimize its properties independently, resolving the contradiction between strength and adaptability.
Solution Approach 2:
The wiring portion uses a composite structure combining metal support layer and conductive layer. The metal support layer (with thickness-to-dimension ratio below 1) provides mechanical strength, while the conductive layer contributes to elasticity and electrical functionality. This composite approach enables simultaneous achievement of structural integrity and thickness-direction elasticity.
2Reliability
If the metal support layer thickness is increased to ensure elasticity, then reliability is improved, but device complexity increases
Solution Approach 1:
The metal support layer is designed with a specific thickness-to-dimension ratio below 1, creating optimal local mechanical properties. This localized quality control ensures elasticity where needed without unnecessarily increasing overall layer complexity or thickness throughout the entire structure.
Data Source
AI summary
A wiring circuit board includes a wiring portion and a first support portion supporting one end portion of the wiring portion. The wiring portion has a metal support layer, a conductive layer, a first insulating layer, and a wiring. A ratio (T1/W1) of a thickness T1 of the metal support layer to a width W1 of the metal support layer is below 1. The conductive layer is disposed on a one-side surface of the metal support layer in a thickness direction of the metal support layer.