Wiring Circuit Board Assembly Sheet for Uniform Pattern Thickness
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Solution Overview
Problem
The thickness of the conductive pattern in wiring circuit boards is non-uniform due to large differences in wiring density between the dummy pattern and the conductive pattern.
Innovation Solution
A wiring circuit board assembly sheet is designed with a frame that includes a dummy conductive pattern made of the same material as the conductive pattern, where the difference in the area percentage of the dummy conductive pattern to the dummy formation region is adjusted to 50% or less, approximating the density of the dummy conductive pattern to that of the conductive pattern, ensuring uniform thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dummy pattern is provided on the support frame to improve uniformity of conductive pattern thickness, then the thickness uniformity is improved, but the wiring density difference between dummy pattern and conductive pattern causes non-uniform thickness
Solution Approach 1:
The patent applies parameter changes by carefully controlling the area percentage of the dummy conductive pattern within the dummy formation region. By adjusting this geometric parameter to fall within specific ranges (50% or less, preferably 30% or less), the patent achieves uniform conductive pattern thickness while managing the wiring density difference between dummy and actual conductive patterns.
Solution Approach 2:
The patent implements local quality by creating a dummy formation region with specific geometric characteristics (width of 5mm from the edge, length equal to the wiring circuit board) and filling it with dummy conductive pattern at a controlled density. This localized approach allows the dummy pattern to compensate for thickness variations in specific areas without affecting the overall wiring density balance.
2Manufacturing precision
If the area percentage of dummy conductive pattern is reduced to approximate conductive pattern density, then conductive pattern thickness becomes uniform, but the dummy pattern area is reduced
Solution Approach 1:
The patent optimizes the area percentage parameter of the dummy conductive pattern to achieve the desired thickness uniformity. By setting this parameter within specific ranges (50% or less, preferably 30% or less), the patent balances the need for sufficient dummy pattern area to ensure uniformity with the need to minimize the overall dummy pattern quantity.
Data Source
AI summary
A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.