Wiring Board Through-Hole Diameter Control for Resin Expansion
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Solution Overview
Problem
In electronic devices, the expansion of resin within through-holes due to heat generated by electronic components can cause insulation layers to be pushed up, leading to warping of conductive patterns and potential rupture of connections between them.
Innovation Solution
A wiring board design featuring a base substrate with conductive patterns, resin-impregnated inorganic cloth insulation layers, and through-holes with diameters between 10 μm to 150 μm, which minimizes the risk of connection rupture by maintaining the integrity of insulation layers and providing an anchoring effect through vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-holes are filled with resin to improve insulation, then insulation performance is improved, but thermal expansion causes insulation layers to be pushed up and conductive patterns to warp
Solution Approach 1:
The patent changes the physical parameters of the through-hole structure by controlling hole diameter (10-150 μm) and depth, which reduces the volume of resin fill material and consequently reduces thermal expansion effects while maintaining insulation performance
Solution Approach 2:
The patent applies different structural characteristics to different regions: shallow through-holes with specific diameter constraints are used in areas where thermal expansion is a concern, while maintaining adequate insulation through optimized hole dimensions rather than filling with expandable resin
2Manufacturing precision
If through-hole diameter is reduced to improve connection precision, then manufacturing precision is improved, but resin expansion damage increases
Solution Approach 1:
The patent optimizes the through-hole diameter parameter to a specific range (10-150 μm) that balances manufacturing precision requirements with minimizing resin expansion damage, avoiding both excessively large and excessively small dimensions
3Stability of the object's composition
If insulation layer thickness is increased to prevent warping, then structural stability is improved, but conductive pattern warping risk increases due to resin expansion pressure
Solution Approach 1:
The patent changes the through-hole dimensions (diameter and depth parameters) to reduce resin expansion pressure, thereby maintaining insulation layer stability and connection reliability without requiring excessive insulation layer thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances connection reliability and productivity by suppressing resin expansion and maintaining structural integrity, even under high temperature conditions, thereby preventing the rupture of conductive pattern connections.
Implementation Method 1
the resin filled in the through-hole expands and the insulation layers at the top and bottom portions of the through-hole are pushed up
Implementation Method 2
insulation layers made with a base material of resin-impregnated inorganic cloth having excellent rigidity and strong shape retention
Data Source
AI summary
A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.