Wiring Board Through-Hole Placement Near Cut Portions
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Solution Overview
Problem
Existing electronic apparatuses with divided multi-board providing boards face stress-related deformation issues during cutting, leading to reduced effective mounting areas due to crack generation in connection members and potential electronic component failure.
Innovation Solution
The electronic apparatus incorporates a wiring board with through-holes adjacent to cut portions, allowing for insertion terminals with insertion mounting structures to connect to the wiring, enhancing stress tolerance and utilizing difficult-to-mount areas effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If circuit components are mounted on the wiring board near cut portions, then the effective mounting area is increased, but stress-induced deformation and crack generation occur reducing connection reliability
Solution Approach 1:
The patent divides the mounting area into two distinct zones: a first mounting area away from cut portions for surface-mounted circuit components, and a second mounting area adjacent to cut portions for through-hole mounted components. This segmentation allows each zone to utilize mounting methods appropriate for its stress characteristics, thereby expanding the total effective mounting area while maintaining connection reliability in both regions.
Solution Approach 2:
The patent applies different mounting strategies to different locations on the wiring board. Areas远离 cut portions use surface mounting for circuit components, while areas near cut portions use through-hole mounting for connectors and external devices. This local differentiation optimizes connection reliability in stress-prone regions while maximizing the overall mounting area.
2Adaptability or versatility
If the wiring board is divided from a multi-board providing board, then flexibility and customization are improved, but stress and deformation are generated during cutting
Solution Approach 1:
The patent segments the wiring board into regions with different structural characteristics. The first mounting area is positioned in structurally stable regions away from cut portions, while the second mounting area is positioned in regions that can accommodate stress near cut portions. This segmentation allows the board to be divided for flexibility while maintaining structural stability in critical areas.
Solution Approach 2:
The patent anticipates stress concentration near cut portions by deliberately positioning the second mounting area away from these high-stress zones. Connectors and external devices are mounted in regions that are less susceptible to stress-induced deformation, thereby cushioning against potential structural failures before they occur.
3Ease of manufacture
If surface mounting is used for all components, then manufacturing simplicity is maintained, but mounting area is limited due to stress-prone regions
Solution Approach 1:
The patent segments the mounting methods by region: surface mounting is used in the first mounting area for standard circuit components, while through-hole mounting is used in the second mounting area for connectors and external devices. This segmented approach maintains manufacturing simplicity in the majority of the board while expanding the total usable mounting area through appropriate use of through-hole techniques in stress-prone regions.
Solution Approach 2:
The patent applies the more complex through-hole mounting method only partially, specifically in the second mounting area near cut portions where surface mounting would be unreliable. This partial application of a more robust mounting technique expands the effective mounting area without unnecessarily complicating the manufacturing process for the entire board.
Data Source
AI summary
An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.